LegalizeThe Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Regulations 2012
| No. | Application | Maximum quantity exempted (if any) | Corresponding EU exemption | Categories of EEE to which exemption applies | Expiry date or status |
|---|---|---|---|---|---|
| (1)OJ No L 326, 19.12.1969, p.36, as last amended by Council Directive 2006/96/EC (OJ No L 363, 20.12.2006, p.81). | (1)OJ No L 326, 19.12.1969, p.36, as last amended by Council Directive 2006/96/EC (OJ No L 363, 20.12.2006, p.81). | (1)OJ No L 326, 19.12.1969, p.36, as last amended by Council Directive 2006/96/EC (OJ No L 363, 20.12.2006, p.81). | (1)OJ No L 326, 19.12.1969, p.36, as last amended by Council Directive 2006/96/EC (OJ No L 363, 20.12.2006, p.81). | (1)OJ No L 326, 19.12.1969, p.36, as last amended by Council Directive 2006/96/EC (OJ No L 363, 20.12.2006, p.81). | (1)OJ No L 326, 19.12.1969, p.36, as last amended by Council Directive 2006/96/EC (OJ No L 363, 20.12.2006, p.81). |
| (2)EUR 2016/1628. | (2)EUR 2016/1628. | (2)EUR 2016/1628. | (2)EUR 2016/1628. | (2)EUR 2016/1628. | (2)EUR 2016/1628. |
| 1 | Mercury in single capped (compact) fluorescent lamps: | ||||
| 1.1 | For general lighting purposes < 30 W | 2.5 mg per burner | Annex 3, 1(a) | all categories | 1st February 2024 |
| 1.2 | For general lighting purposes ≥ 30 W and < 50 W | 3.5 mg per burner | Annex 3, 1(b) | all categories | 1st February 2024 |
| 1.3 | For general lighting purposes ≥ 50 W and < 150 W | 5 mg per burner | Annex 3, 1(c) | all categories | 1st February 2024 |
| 1.4 | For general lighting purposes ≥ 150 W | 15 mg per burner | Annex 3, 1(d) | all categories | 1st February 2024 |
| 1.5 | For general lighting purposes with circular or square structural shape and tube diameter ≤ 17 mm | 5 mg per burner | Annex 3, 1(e) | all categories | 1st February 2024 |
| 1.6 | For general lighting purposes < 30 W with a lifetime ≥ 20,000 h | 3.5 mg per burner | Annex 3, 1(g) | all categories | 1st February 2024 |
| 1.7 | For special purposes | 5 mg per burner | Annex 3, 1(f)-II | all categories | 24th February 2025 |
| 1.8 | For lamps designed to emit mainly light in the ultraviolet spectrum | 5mg per burner | Annex 3, 1(f)- I | all categories | 24th February 2027 |
| 2 | Mercury in double-capped linear fluorescent lamps for general lighting purposes: | ||||
| 2.1 | Tri-band phosphor with normal lifetime (< 25,000 h) and a tube diameter < 9 mm (e.g. T2) | 4 mg per lamp | Annex 3, 2(a)(1) | all categories | 1st February 2024 |
| 2.2 | Tri-band phosphor with normal lifetime (< 25,000 h) and a tube diameter ≥ 9mm and ≤ 17 mm (e.g. T5) | 3 mg per lamp | Annex 3, 2(a)(2) | all categories | 1st February 2024 |
| 2.3 | Tri-band phosphor with normal lifetime (< 25,000 h) and a tube diameter > 17mm and ≤ 28 mm (e.g. T8) | 3.5 mg per lamp | Annex 3, 2(a)(3) | all categories | 1st February 2024 |
| 2.4 | Tri-band phosphor with normal lifetime (< 25,000 h) and a tube diameter > 28mm (e.g. T12) | 3.5 mg per lamp | Annex 3, 2(a) (4) | all categories | 1st February 2024 |
| 2.5 | Tri-band phosphor with long lifetime (≥ 25,000 h) | 5 mg per lamp | Annex 3, 2(a) (5) | all categories | 1st February 2024 |
| 3 | Mercury in other fluorescent lamps: | ||||
| 3.1 | Non-linear tri-band phosphor lamps with tube diameter > 17 mm (e.g. T9) | 15 mg per lamp | Annex 3, 2(b)(3) | all categories | 1st February 2024 |
| 3.2 | From 2nd February 2024, non-linear tri-band phosphor lamps with tube diameter > 17 mm (e.g. T9) | 10 mg per lamp | Annex 3, 2(b)(3) | all categories | 24th February 2025 |
| 3.3 | Lamps for other general lighting purposes and special purposes (e.g. induction lamps) | 15 mg per lamp | Annex 3, 2(b)(4)- I | all categories | 24th February 2025 |
| 3.4 | Lamps emitting mainly light in the ultraviolet spectrum | 15 mg per lamp | Annex 3, 2(b)(4)- II | all categories | 24th February 2027 |
| 3.5 | Emergency lamps | 15 mg per lamp | Annex 3, 2(b)(4)- III | all categories | 24th February 2027 |
| 4 | Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes used in EEE placed on the market before 24th February 2022: | ||||
| 4.1 | Short length (≤ 500 mm) | 3.5 mg per lamp | Annex 3, 3(a) | all categories | 24th February 2025 |
| 4.2 | Medium length (> 500 mm and ≤ 1500 mm) | 5 mg per lamp | Annex 3, 3(b) | all categories | 24th February 2025 |
| 4.3 | Long length (> 1500 mm) | 13 mg per lamp | Annex 3, 3(c) | all categories | 24th February 2025 |
| 5 | Mercury in other low pressure discharge lamps: | ||||
| 5.1 | Mercury in low pressure non-phosphor coated discharge lamps, where the application requires the main range of the lamp-spectral output to be in the ultraviolet spectrum | 15 mg per lamp | Annex 3, 4(a)- I | all categories | 24th February 2027 |
| 5.2 | Mercury in other low pressure discharge lamps | 15 mg per lamp | Annex 3, 4(a) | all categories | 1st February 2024 |
| 6 | Mercury in High Pressure Sodium (vapour) lamps for general lighting: | ||||
| 6.1 | Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes in lamps with improved colour rendering index Ra > 80: P ≤ 105 W | 16 mg per burner | Annex 3, 4(b) | all categories | 24th February 2027 |
| 6.2 | Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes in lamps with improved colour rendering index Ra > 60: P ≤ 155 W | 30 mg per burner | Annex 3, 4(b)- I | all categories | 1st February 2024 |
| 6.3 | Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes in lamps with improved colour rendering index Ra > 60: 155 W < P ≤ 405 W | 40 mg per burner | Annex 3, 4(b)- II | all categories | 1st February 2024 |
| 6.4 | Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes in lamps with improved colour rendering index Ra > 60: P > 405 W | 40 mg per burner | Annex 3, 4(b)- III | all categories | 1st February 2024 |
| 7 | Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes: | ||||
| 7.1 | P ≤ 155 W | 20 mg per burner | Annex 3, 4(c)- I | all categories | 24th February 2027 |
| 7.2 | 155 W < P ≤ 405 W | 25 mg per burner | Annex 3, 4(c)-II | all categories | 24th February 2027 |
| 7.3 | P > 405 W | 25 mg per burner | Annex 3, 4(c)-III | all categories | 24th February 2027 |
| 8 | Mercury in metal halide lamps | Annex 3, 4(e) | all categories | 24th February 2027 | |
| 9 | Mercury in other discharge lamps: | ||||
| 9.1 | Mercury in high pressure mercury vapour lamps used in projectors where an output ≥ 200 lumen ANSI is required | Annex 3, 4(f)- II | all categories | 24th February 2027 | |
| 9.2 | Mercury in high pressure sodium lamps used for horticulture lighting | Annex 3, 4(f)- III | all categories | 24th February 2027 | |
| 9.3 | Mercury in lamps emitting light in the ultraviolet spectrum | Annex 3, 4(f)- IV | all categories | 24th February 2027 | |
| 9.4 | Mercury in other discharge lamps for special purposes not specifically mentioned in another entry in this Table | Annex 3, 4(f)-I | all categories | 24th February 2025 | |
| 10 | Lead in glass of cathode ray tubes. | Annex 3, 5(a) | 8x, 9x | 21st July 2021 | |
| 10 | Lead in glass of cathode ray tubes. | Annex 3, 5(a) | 8iv | 21st July 2023 | |
| 10 | Lead in glass of cathode ray tubes. | Annex 3, 5(a) | 9ind, 11 | 21st July 2024 | |
| 11 | Lead in glass of fluorescent tubes. | 0.2% lead by weight | Annex 3, 5(b) | 1–7, 10 | transitional case |
| 11 | Lead in glass of fluorescent tubes. | 0.2% lead by weight | Annex 3, 5(b) | 8x, 9x | 21st July 2021 |
| 11 | Lead in glass of fluorescent tubes. | 0.2% lead by weight | Annex 3, 5(b) | 8iv | 21st July 2023 |
| 11 | Lead in glass of fluorescent tubes. | 0.2% lead by weight | Annex 3, 5(b) | 9ind, 11 | 21st July 2024 |
| 12 | Lead as an alloying element in steel for machining purposes and in galvanised steel. | 0.35% lead by weight | Annex 3, 6(a) | 8, 9 | transitional case |
| 12 | Lead as an alloying element in steel for machining purposes and in galvanised steel. | 0.35% lead by weight | Annex 3, 6(a) | 11 | 21st July 2024 |
| 13 | Lead as an alloying element in steel for machining purposes. | 0.35% lead by weight | Annex 3, 6(a)-I | 1-7, 10 | transitional case |
| 14 | Lead as an alloying element in batch hot dip galvanised steel components. | 0.2% lead by weight | Annex 3, 6(a)-I | 1-7, 10 | transitional case |
| 15 | Lead as an alloying element in aluminium. | 0.4% lead by weight | Annex 3, 6(b) | 8, 9 | transitional case |
| 15 | Lead as an alloying element in aluminium. | 0.4% lead by weight | Annex 3, 6(b) | 11 | 21st July 2024 |
| 16 | Lead as an alloying element in aluminium, provided it stems from lead-bearing aluminium scrap recycling. | 0.4% lead by weight | Annex 3, 6(b)-I | 1-7, 10 | transitional case |
| 17 | Lead as an alloying element in aluminium for machining purposes. | 0.4% lead by weight | Annex 3, 6(b)-II | 1-7, 10 | transitional case |
| 18 | Copper alloy containing lead. | 4% lead by weight | Annex 3, 6(c) | 1-10 | transitional case |
| 18 | Copper alloy containing lead. | 4% lead by weight | Annex 3, 6(c) | 11 | 21st July 2024 |
| 19 | Lead in high melting temperature type solders, i.e. lead-based alloys containing 85% by weight or more lead.This entry does not apply to applications covered by entry 42. | Annex 3, 7(a) | 1-10 | transitional case | |
| 19 | Lead in high melting temperature type solders, i.e. lead-based alloys containing 85% by weight or more lead.This entry does not apply to applications covered by entry 42. | Annex 3, 7(a) | 11 | 21st July 2024 | |
| 20 | Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission, and network management for telecommunications. | Annex 3, 7(b) | 8x, 9x | 21st July 2021 | |
| 20 | Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission, and network management for telecommunications. | Annex 3, 7(b) | 8iv | 21st July 2023 | |
| 20 | Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission, and network management for telecommunications. | Annex 3, 7(b) | 9ind, 11 | 21st July 2024 | |
| 21 | Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound.This entry does not apply to applications covered by entry 49. | Annex 3, 7(c)-I | 1-10 | transitional case | |
| 21 | Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound.This entry does not apply to applications covered by entry 49. | Annex 3, 7(c)-I | 11 | 21st July 2024 | |
| 22 | Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher.This entry does not apply to applications covered by entry 21 or 23. | Annex 3, 7(c)-II | 1 – 10 | transitional case | |
| 22 | Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher.This entry does not apply to applications covered by entry 21 or 23. | Annex 3, 7(c)-II | 11 | 21st July 2024 | |
| 23 | Lead in PZT based dielectric ceramic materials for capacitors which are part of integrated circuits or discrete semiconductors. | Annex 3, 7(c)-IV | 1-7, 8x, 9x, 10 | 21st July 2021 | |
| 23 | Lead in PZT based dielectric ceramic materials for capacitors which are part of integrated circuits or discrete semiconductors. | Annex 3, 7(c)-IV | 8iv | 21st July 2023 | |
| 23 | Lead in PZT based dielectric ceramic materials for capacitors which are part of integrated circuits or discrete semiconductors. | Annex 3, 7(c)-IV | 9ind, 11 | 21st July 2024 | |
| 24 | Cadmium and its compounds in electrical contacts. | Annex 3, 8(b) | 8, 9 | transitional case | |
| 24 | Cadmium and its compounds in electrical contacts. | Annex 3, 8(b) | 11 | 21st July 2024 | |
| 25 | Cadmium and its compounds in electrical contacts used in:— circuit breakers,— thermal sensing controls,— thermal motor protectors (excluding hermetic thermal motor protectors),— AC switches rated at:6 A and more at 250 V AC and more, or12 A and more at 125 V AC and more,— DC switches rated at 20 A and more at 18 V DC and more, and— switches for use at voltage supply frequency ≥ 200 Hz. | Annex 3, 8(b)-I | 1-7, 10 | transitional case | |
| 26 | Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0.75 % by weight in the cooling solution. | Annex 3, 9 | 8x, 9x | 21st July 2021 | |
| 26 | Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0.75 % by weight in the cooling solution. | Annex 3, 9 | 8iv | 21st July 2023 | |
| 26 | Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0.75 % by weight in the cooling solution. | Annex 3, 9 | 9ind, 11 | 21st July 2024 | |
| 27 | Lead in bearing shells and bushes for refrigerant-containing compressors for heating, ventilation, air conditioning and refrigeration (HVACR) applications. | Annex 3, 9(b) | 8x, 9x | 21st July 2021 | |
| 27 | Lead in bearing shells and bushes for refrigerant-containing compressors for heating, ventilation, air conditioning and refrigeration (HVACR) applications. | Annex 3, 9(b) | 8iv | 21st July 2023 | |
| 27 | Lead in bearing shells and bushes for refrigerant-containing compressors for heating, ventilation, air conditioning and refrigeration (HVACR) applications. | Annex 3, 9(b) | 9ind, 11 | 21st July 2024 | |
| 28 | Lead in white glasses used for optical applications. | Annex 3, 13(a) | all categories | transitional case | |
| 29 | Cadmium and lead in filter glasses and glasses used for reflectance standards. | Annex 3, 13(b) | 8, 9, 11 | transitional case | |
| 30 | Lead in ion coloured optical filter glass types. | Annex 3, 13(b)-(I) | 1-7, 10 | transitional case | |
| 31 | Cadmium in striking optical filter glass types. | Annex 3, 13(b)-(II) | 1-7, 10 | transitional case | |
| 32 | Cadmium and lead in glazes used for reflectance standards. | Annex 3, 13(b)-(III) | 1-7, 10 | transitional case | |
| 33 | Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages. | Annex 3, 15 | 8, 9 | transitional case | |
| 33 | Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages. | Annex 3, 15 | 11 | 21st July 2024 | |
| 34 | Lead in solders to complete a viable electrical connection between the semiconductor die and carrier within integrated circuit flip chip packages where at least one of the following criteria applies:— a semiconductor technology node of 90 nm or larger;— a single die of 300 mm² or larger in any semi-conductor technology node;— stacked die packages with die of 300 mm² or larger, or silicon interposers of 300mm² or larger. | Annex 3, 15(a) | 1–7, 10 | transitional case | |
| 35 | Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications. | Annex 3, 17 | 8x, 9x | 21st July 2021 | |
| 35 | Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications. | Annex 3, 17 | 8iv | 21st July 2023 | |
| 35 | Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications. | Annex 3, 17 | 9ind, 11 | 21st July 2024 | |
| 36 | Lead as activator in the fluorescent powder of discharge lamps containing phosphors such as BSP (BaSi₂O₅:Pb) when used as sun tanning lamps. | 1% lead by weight or less | Annex 3, 18(b) | 1–7, 8x, 9x, 10 | transitional case |
| 36 | Lead as activator in the fluorescent powder of discharge lamps containing phosphors such as BSP (BaSi₂O₅:Pb) when used as sun tanning lamps. | 1% lead by weight or less | Annex 3, 18(b) | 8iv | 21st July 2023 |
| 36 | Lead as activator in the fluorescent powder of discharge lamps containing phosphors such as BSP (BaSi₂O₅:Pb) when used as sun tanning lamps. | 1% lead by weight or less | Annex 3, 18(b) | 9ind, 11 | 21st July 2024 |
| 37 | Lead as activator in the fluorescent powder of discharge lamps containing phosphors such as BSP (BaSi₂O₅:Pb) when used in medical phototherapy equipment.This entry does not apply to applications covered by entry 88. | 1% lead by weight or less | Annex 3, 18(b)-I | 5, 8 | transitional case |
| 38 | Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses. | Annex 3, 21 | 8x, 9x | 21st July 2021 | |
| 38 | Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses. | Annex 3, 21 | 8iv | 21st July 2023 | |
| 38 | Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses. | Annex 3, 21 | 9ind, 11 | 21st July 2024 | |
| 39 | Cadmium when used in colour printed glass to provide filtering functions, used as a component in lighting applications installed in displays and control panels of EEE. | Annex 3, 21(a) | 1–7, 10 | 21st July 2021 | |
| 40 | Cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses. | Annex 3, 21(b) | 1–7, 10 | 21st July 2021 | |
| 41 | Lead in printing inks for the application of enamels on other than borosilicate glasses. | Annex 3, 21(c) | 1–7, 10 | 21st July 2021 | |
| 42 | Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors. | Annex 3, 24 | 1–10 | transitional case | |
| 42 | Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors. | Annex 3, 24 | 11 | 21st July 2024 | |
| 43 | Lead oxide in surface conduction electron emitter displays (SED) used in structural elements, notably in the seal frit and frit ring. | Annex 3, 25 | 8x, 9x | 21st July 2021 | |
| 43 | Lead oxide in surface conduction electron emitter displays (SED) used in structural elements, notably in the seal frit and frit ring. | Annex 3, 25 | 8iv | 21st July 2023 | |
| 43 | Lead oxide in surface conduction electron emitter displays (SED) used in structural elements, notably in the seal frit and frit ring. | Annex 3, 25 | 9ind, 11 | 21st July 2024 | |
| 44 | Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC[^f01000]. | Annex 3, 29 | 1–7, 10, 11 | transitional case | |
| 44 | Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC[^f01000]. | Annex 3, 29 | 8x, 9x | 21st July 2021 | |
| 44 | Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC[^f01000]. | Annex 3, 29 | 8iv | 21st July 2023 | |
| 44 | Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC[^f01000]. | Annex 3, 29 | 9ind | 21st July 2024 | |
| 45 | Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more. | Annex 3, 30 | 8x, 9x | 21st July 2021 | |
| 45 | Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more. | Annex 3, 30 | 8iv | 21st July 2023 | |
| 45 | Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more. | Annex 3, 30 | 9ind, 11 | 21st July 2024 | |
| 46 | Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting). | Annex 3, 31 | 8x, 9x | 21st July 2021 | |
| 46 | Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting). | Annex 3, 31 | 8iv | 21st July 2023 | |
| 46 | Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting). | Annex 3, 31 | 9ind, 11 | 21st July 2024 | |
| 47 | Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes. | Annex 3, 32 | 1–7, 8x, 9, 10 | transitional case | |
| 47 | Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes. | Annex 3, 32 | 8iv | 21st July 2023 | |
| 47 | Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes. | Annex 3, 32 | 11 | 21st July 2024 | |
| 48 | Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformers. | Annex 3, 33 | 8x, 9x | 21st July 2021 | |
| 48 | Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformers. | Annex 3, 33 | 8iv | 21st July 2023 | |
| 48 | Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformers. | Annex 3, 33 | 9ind, 11 | 21st July 2024 | |
| 49 | Lead in cermet-based trimmer potentiometer elements. | Annex 3, 34 | 1–10 | transitional case | |
| 49 | Lead in cermet-based trimmer potentiometer elements. | Annex 3, 34 | 11 | 21st July 2024 | |
| 50 | Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body. | Annex 3, 37 | 1–7, 8x, 9x, 10 | 21st July 2021 | |
| 50 | Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body. | Annex 3, 37 | 8iv | 21st July 2023 | |
| 50 | Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body. | Annex 3, 37 | 9ind, 11 | 21st July 2024 | |
| 51 | Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide. | Annex 3, 38 | 8x, 9x | 21st July 2021 | |
| 51 | Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide. | Annex 3, 38 | 8iv | 21st July 2023 | |
| 51 | Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide. | Annex 3, 38 | 9ind, 11 | 21st July 2024 | |
| 52 | Cadmium selenide in downshifting cadmium-based semiconductor nanocrystal quantum dots for use in display lighting applications (< 0.2 μg Cd per mm² of display screen area). | Annex 3, 39(a) | all categories | transitional case | |
| 53 | Lead in solders and termination finishes of electrical and electronic components and finishes of printed circuit boards used in ignition modules and other electrical and electronic engine control systems, which for technical reasons must be mounted directly on or in the crankcase or cylinder of hand-held combustion engines (category NRSh in Regulation (EU) 2016/1628 of the European Parliament and of the Council[^f01001]). | Annex 3, 41 | 1–7, 10, 11 | 31st March 2022 | |
| 53 | Lead in solders and termination finishes of electrical and electronic components and finishes of printed circuit boards used in ignition modules and other electrical and electronic engine control systems, which for technical reasons must be mounted directly on or in the crankcase or cylinder of hand-held combustion engines (category NRSh in Regulation (EU) 2016/1628 of the European Parliament and of the Council[^f01001]). | Annex 3, 41 | 8x, 9x | 21st July 2021 | |
| 53 | Lead in solders and termination finishes of electrical and electronic components and finishes of printed circuit boards used in ignition modules and other electrical and electronic engine control systems, which for technical reasons must be mounted directly on or in the crankcase or cylinder of hand-held combustion engines (category NRSh in Regulation (EU) 2016/1628 of the European Parliament and of the Council[^f01001]). | Annex 3, 41 | 8iv | 21st July 2023 | |
| 53 | Lead in solders and termination finishes of electrical and electronic components and finishes of printed circuit boards used in ignition modules and other electrical and electronic engine control systems, which for technical reasons must be mounted directly on or in the crankcase or cylinder of hand-held combustion engines (category NRSh in Regulation (EU) 2016/1628 of the European Parliament and of the Council[^f01001]). | Annex 3, 41 | 9ind | 21st July 2024 | |
| 54 | Lead in bearings and bushes of diesel or gaseous fuel powered internal combustion engines applied in non-road professional use equipment:— with engine total displacement ≥ 15 litres; or— with engine total displacement < 15 litres and the engine is designed to operate in applications where the time between signal to start and full load is required to be less than 10 seconds; or regular maintenance is typically performed in a harsh and dirty outdoor environment, such as mining, construction, and agriculture applications.This entry does not apply to applications covered by entry 18. | Annex 3, 42 | 8x, 9x | transitional case | |
| 54 | Lead in bearings and bushes of diesel or gaseous fuel powered internal combustion engines applied in non-road professional use equipment:— with engine total displacement ≥ 15 litres; or— with engine total displacement < 15 litres and the engine is designed to operate in applications where the time between signal to start and full load is required to be less than 10 seconds; or regular maintenance is typically performed in a harsh and dirty outdoor environment, such as mining, construction, and agriculture applications.This entry does not apply to applications covered by entry 18. | Annex 3, 42 | 11 | 21st July 2024 | |
| 55 | Bis(2-ethylhexyl) phthalate in rubber components in engine systems, designed for use in equipment that is not intended solely for consumer use and provided that no plasticised material comes into contact with human mucous membranes or into prolonged contact with human skin.This entry applies where the concentration value of bis(2-ethylhexyl) phthalate does not exceed:30 % by weight of the rubber for:gasket coatings;solid-rubber gaskets; orrubber components included in assemblies of at least three components using electrical, mechanical or hydraulic energy to do work, and attached to the engine.10% by weight of the rubber for rubber-containing components not referred to in point (a).For the purposes of this entry, ‘prolonged contact with human skin’ means continuous contact of more than 10 minutes duration or intermittent contact over a period of 30 minutes, per day. | Annex 3, 43 | 9ind | 15th July 2023 | |
| 55 | Bis(2-ethylhexyl) phthalate in rubber components in engine systems, designed for use in equipment that is not intended solely for consumer use and provided that no plasticised material comes into contact with human mucous membranes or into prolonged contact with human skin.This entry applies where the concentration value of bis(2-ethylhexyl) phthalate does not exceed:30 % by weight of the rubber for:gasket coatings;solid-rubber gaskets; orrubber components included in assemblies of at least three components using electrical, mechanical or hydraulic energy to do work, and attached to the engine.10% by weight of the rubber for rubber-containing components not referred to in point (a).For the purposes of this entry, ‘prolonged contact with human skin’ means continuous contact of more than 10 minutes duration or intermittent contact over a period of 30 minutes, per day. | Annex 3, 43 | 11 | 21st July 2024 | |
| 56 | Lead in solder of sensors, actuators, and engine control units of combustion engines within the scope of Regulation (EU) 2016/1628 of the European Parliament and of the Council, installed in equipment used at fixed positions while in operation which is designed for professionals, but also used by non-professional users. | Annex 3, 44 | 11 | 21st July 2024 | |
| 57 | Lead, cadmium and mercury in detectors for ionising radiation. | Annex 4, 1 | 8x, 9x, 9ind | transitional case | |
| 57 | Lead, cadmium and mercury in detectors for ionising radiation. | Annex 4, 1 | 8iv | 21st July 2023 | |
| 58 | Lead bearings in X-ray tubes. | Annex 4, 2 | 8x, 9x | transitional case | |
| 58 | Lead bearings in X-ray tubes. | Annex 4, 2 | 8iv | 21st July 2023 | |
| 58 | Lead bearings in X-ray tubes. | Annex 4, 2 | 9ind | 21st July 2024 | |
| 59 | Lead in electromagnetic radiation amplification devices:micro-channel plate and capillary plate. | Annex 4, 3 | 8, 9 | transitional case | |
| 60 | Lead in glass frit of X-ray tubes and image intensifiers and lead in glass frit binder for assembly of gas lasers and for vacuum tubes that convert electromagnetic radiation into electrons. | Annex 4, 4 | 8x, 9x | 21st July 2021 | |
| 60 | Lead in glass frit of X-ray tubes and image intensifiers and lead in glass frit binder for assembly of gas lasers and for vacuum tubes that convert electromagnetic radiation into electrons. | Annex 4, 4 | 8iv | 21st July 2023 | |
| 60 | Lead in glass frit of X-ray tubes and image intensifiers and lead in glass frit binder for assembly of gas lasers and for vacuum tubes that convert electromagnetic radiation into electrons. | Annex 4, 4 | 9ind | 21st July 2024 | |
| 61 | Lead in shielding for ionising radiation. | Annex 4, 5 | 8x, 9 | transitional case | |
| 61 | Lead in shielding for ionising radiation. | Annex 4, 5 | 8iv | 21st July 2023 | |
| 62 | Lead in X-ray test objects. | Annex 4, 6 | 8x, 9x | 21st July 2021 | |
| 62 | Lead in X-ray test objects. | Annex 4, 6 | 8iv | 21st July 2023 | |
| 62 | Lead in X-ray test objects. | Annex 4, 6 | 9ind | 21st July 2024 | |
| 63 | Lead stearate X-ray diffraction crystals. | Annex 4, 7 | 8x, 9x | 21st July 2021 | |
| 63 | Lead stearate X-ray diffraction crystals. | Annex 4, 7 | 8iv | 21st July 2023 | |
| 63 | Lead stearate X-ray diffraction crystals. | Annex 4, 7 | 9ind | 21st July 2024 | |
| 64 | Radioactive cadmium isotope source for portable X-ray fluorescence spectrometers. | Annex 4, 8 | 8x, 9x | 21st July 2021 | |
| 64 | Radioactive cadmium isotope source for portable X-ray fluorescence spectrometers. | Annex 4, 8 | 8iv | 21st July 2023 | |
| 64 | Radioactive cadmium isotope source for portable X-ray fluorescence spectrometers. | Annex 4, 8 | 9ind | 21st July 2024 | |
| 65 | Lead and cadmium in ion selective electrodes including glass of pH electrodes. | Annex 4, 1a | 8x, 9 | transitional case | |
| 65 | Lead and cadmium in ion selective electrodes including glass of pH electrodes. | Annex 4, 1a | 8iv | 21st July 2023 | |
| 66 | Lead anodes in electrochemical oxygen sensors. | Annex 4, 1b | 8x, 9 | transitional case | |
| 66 | Lead anodes in electrochemical oxygen sensors. | Annex 4, 1b | 8iv | 21st July 2023 | |
| 67 | Lead, cadmium and mercury in infra-red light detectors. | Annex 4, 1c | 8, 9 | transitional case | |
| 68 | Mercury in reference electrodes: low chloride mercury chloride, mercury sulphate and mercury oxide. | Annex 4, 1d | 8x, 9x | 21st July 2021 | |
| 68 | Mercury in reference electrodes: low chloride mercury chloride, mercury sulphate and mercury oxide. | Annex 4, 1d | 8iv | 21st July 2023 | |
| 68 | Mercury in reference electrodes: low chloride mercury chloride, mercury sulphate and mercury oxide. | Annex 4, 1d | 9ind | 21st July 2024 | |
| 69 | Cadmium in helium-cadmium lasers. | Annex 4, 9 | 8x, 9x | 21st July 2021 | |
| 69 | Cadmium in helium-cadmium lasers. | Annex 4, 9 | 8iv | 21st July 2023 | |
| 69 | Cadmium in helium-cadmium lasers. | Annex 4, 9 | 9ind | 21st July 2024 | |
| 70 | Lead and cadmium in atomic absorption spectroscopy lamps. | Annex 4, 10 | 8x, 9x | 21st July 2021 | |
| 70 | Lead and cadmium in atomic absorption spectroscopy lamps. | Annex 4, 10 | 8iv | 21st July 2023 | |
| 70 | Lead and cadmium in atomic absorption spectroscopy lamps. | Annex 4, 10 | 9ind | 21st July 2024 | |
| 71 | Lead in alloys as a superconductor and thermal conductor in MRI. | Annex 4, 11 | 8x, 9x | transitional case | |
| 71 | Lead in alloys as a superconductor and thermal conductor in MRI. | Annex 4, 11 | 8iv | 21st July 2023 | |
| 71 | Lead in alloys as a superconductor and thermal conductor in MRI. | Annex 4, 11 | 9ind | 21st July 2024 | |
| 72 | Lead and cadmium in metallic bonds creating superconducting magnetic circuits in MRI, SQUID, NMR (Nuclear Magnetic Resonance) or FTMS (Fourier Transform Mass Spectrometer) detectors. | Annex 4, 12 | 8x, 9 | transitional case | |
| 72 | Lead and cadmium in metallic bonds creating superconducting magnetic circuits in MRI, SQUID, NMR (Nuclear Magnetic Resonance) or FTMS (Fourier Transform Mass Spectrometer) detectors. | Annex 4, 12 | 8iv | 30th June 2021 | |
| 73 | Lead in counterweights. | Annex 4, 13 | 8x, 9x | transitional case | |
| 73 | Lead in counterweights. | Annex 4, 13 | 38iv | 21st July 2023 | |
| 73 | Lead in counterweights. | Annex 4, 13 | 9ind | 21st July 2024 | |
| 74 | Lead in single crystal piezoelectric materials for ultrasonic transducers. | Annex 4, 14 | 8x, 9x | transitional case | |
| 74 | Lead in single crystal piezoelectric materials for ultrasonic transducers. | Annex 4, 14 | 8iv | 21st July 2023 | |
| 74 | Lead in single crystal piezoelectric materials for ultrasonic transducers. | Annex 4, 14 | 9ind | 21st July 2024 | |
| 75 | Lead in solders for bonding to ultrasonic transducers. | Annex 4, 15 | 8x, 9x | transitional case | |
| 75 | Lead in solders for bonding to ultrasonic transducers. | Annex 4, 15 | 8iv | 21st July 2023 | |
| 75 | Lead in solders for bonding to ultrasonic transducers. | Annex 4, 15 | 9ind | 21st July 2024 | |
| 76 | Mercury in very high accuracy capacitance and loss measurement bridges and in high frequency RF switches and relays in monitoring and control instruments. | 20mg of mercury per switch or relay | Annex 4, 16 | 8x, 9x | 21st July 2021 |
| 76 | Mercury in very high accuracy capacitance and loss measurement bridges and in high frequency RF switches and relays in monitoring and control instruments. | 20mg of mercury per switch or relay | Annex 4, 16 | 8iv | 21st July 2023 |
| 76 | Mercury in very high accuracy capacitance and loss measurement bridges and in high frequency RF switches and relays in monitoring and control instruments. | 20mg of mercury per switch or relay | Annex 4, 16 | 9ind | 21st July 2024 |
| 77 | Lead in solders in portable emergency defibrillators. | Annex 4, 17 | 8x, 9x | transitional case | |
| 77 | Lead in solders in portable emergency defibrillators. | Annex 4, 17 | 8iv | 21st July 2023 | |
| 77 | Lead in solders in portable emergency defibrillators. | Annex 4, 17 | 9ind | 21st July 2024 | |
| 78 | Lead in solders of high performance infrared imaging modules to detect in the range 8-14 μm. | Annex 4, 18 | 8x, 9x | transitional case | |
| 78 | Lead in solders of high performance infrared imaging modules to detect in the range 8-14 μm. | Annex 4, 18 | 8iv | 21st July 2023 | |
| 78 | Lead in solders of high performance infrared imaging modules to detect in the range 8-14 μm. | Annex 4, 18 | 9ind | 21st July 2024 | |
| 79 | Lead in liquid crystal on silicon (LCoS) displays. | Annex 4, 19 | 8x, 9x | 21st July 2021 | |
| 79 | Lead in liquid crystal on silicon (LCoS) displays. | Annex 4, 19 | 8iv | 21st July 2023 | |
| 79 | Lead in liquid crystal on silicon (LCoS) displays. | Annex 4, 19 | 9ind | 21st July 2024 | |
| 80 | Cadmium in X-ray measurement filters. | Annex 4, 20 | 8x, 9x | transitional case | |
| 80 | Cadmium in X-ray measurement filters. | Annex 4, 20 | 8iv | 21st July 2023 | |
| 80 | Cadmium in X-ray measurement filters. | Annex 4, 20 | 9ind | 21st July 2024 | |
| 81 | Lead acetate marker for use in stereotactic head frames for use with CT and MRI and in positioning systems for gamma beam and particle therapy equipment. | Annex 4, 22 | 8, 9 | 30th June 2021 | |
| 82 | Lead as an alloying element for bearings and wear surfaces in medical equipment exposed to ionising radiation. | Annex 4, 23 | 8, 9 | 30th June 2021 | |
| 83 | Lead in the surface coatings of pin connector systems. requiring nonmagnetic connectors which are used durably at a temperature below –20 °C under normal operating and storage conditions. | Annex 4, 25 | 8, 9 | 30th June 2021 | |
| 84 | Lead in the following applications that are used durably at a temperature below –20 °C under normal operating and storage conditions:solders on printed circuit boards;termination coatings of electrical and electronic components and coatings of printed circuit boards;solders for connecting wires and cables;solders connecting transducers and sensors.Lead in solders of electrical connections to temperature measurement sensors in devices which are designed to be used periodically at temperatures below –150 °C. | Annex 4, 26 | 8x, 9 | transitional case | |
| 84 | Lead in the following applications that are used durably at a temperature below –20 °C under normal operating and storage conditions:solders on printed circuit boards;termination coatings of electrical and electronic components and coatings of printed circuit boards;solders for connecting wires and cables;solders connecting transducers and sensors.Lead in solders of electrical connections to temperature measurement sensors in devices which are designed to be used periodically at temperatures below –150 °C. | Annex 4, 26 | 8iv | 30th June 2021 | |
| 85 | Lead in:— solders,— termination coatings of electrical and electronic components and printed circuit boards,— connections of electrical wires, shields and enclosed connectors,which are used in:magnetic fields within the sphere of 1 m radius around the isocentre of the magnet in medical magnetic resonance imaging equipment, including patient monitors designed to be used within this sphere, ormagnetic fields within 1 m distance from the external surfaces of cyclotron magnets, magnets for beam transport and beam direction control applied for particle therapy. | Annex 4, 27 | 8, 9x | transitional case | |
| 86 | Lead in alloys, as a superconductor or thermal conductor, used in cryo-cooler cold heads and/or in cryo-cooled cold probes and/or in cryo-cooled equipotential bonding systems, in medical devices or in industrial monitoring and control instruments. | Annex 4, 29 | 8x | transitional case | |
| 86 | Lead in alloys, as a superconductor or thermal conductor, used in cryo-cooler cold heads and/or in cryo-cooled cold probes and/or in cryo-cooled equipotential bonding systems, in medical devices or in industrial monitoring and control instruments. | Annex 4, 29 | 8iv, 9ind | 30th June 2021 | |
| 87 | Lead, cadmium, hexavalent chromium, and polybrominated diphenyl ethers (PBDE) in spare parts recovered from and used for the repair or refurbishment of medical devices, including in vitro diagnostic medical devices, or electron microscopes and their accessories, provided that the reuse takes place in auditable closed-loop business-to-business return systems and that each reuse of parts is notified to the customer. | Annex 4, 31a | 8, 9x | transitional case | |
| 87 | Lead, cadmium, hexavalent chromium, and polybrominated diphenyl ethers (PBDE) in spare parts recovered from and used for the repair or refurbishment of medical devices, including in vitro diagnostic medical devices, or electron microscopes and their accessories, provided that the reuse takes place in auditable closed-loop business-to-business return systems and that each reuse of parts is notified to the customer. | Annex 4, 31a | 9ind | 21st July 2024 | |
| 88 | Lead as an activator in the fluorescent powder of discharge lamps when used for extracorporeal photopheresis lamps containing BSP (BaSi₂O₅:Pb) phosphors. | Annex 4, 34 | 8, 9 | 22nd July 2021 | |
| 89 | Mercury in cold cathode fluorescent lamps for back-lighting liquid crystal displays, not exceeding 5 mg per lamp, used in industrial monitoring and control instruments placed on the market before 22 July 2017. | Annex 4, 35 | 9ind | 21st July 2024 | |
| 90 | Lead in platinized platinum electrodes used for conductivity measurements where at least one of the following conditions applies:wide-range measurements with a conductivity range covering more than 1 order of magnitude (e.g. range between 0.1 mS/m and 5 mS/m) in laboratory applications for unknown concentrations;measurements of solutions where an accuracy of +/– 1 % of the sample range and where high corrosion resistance of the electrode are required for any of the following:solutions with an acidity < pH 1;solutions with an alkalinity > pH 13;corrosive solutions containing halogen gas;measurements of conductivities above 100 mS/m that must be performed with portable instruments. | Annex 4, 37 | 8, 9 | 31st December 2025 | |
| 91 | Lead in micro-channel plates (MCPs) used in equipment where at least one of the following properties is present:a compact size of the detector for electrons or ions, where the space for the detector is limited to a maximum of 3 mm/MCP (detector thickness + space for installation of the MCP), a maximum of 6 mm in total, and an alternative design yielding more space for the detector is scientifically and technically impracticable;a two-dimensional spatial resolution for detecting electrons or ions, where at least one of the following applies:a response time shorter than 25 ns;a sample detection area larger than 149 mm² ;a multiplication factor larger than 1.3 × 10³ .a response time shorter than 5 ns for detecting electrons or ions;a sample detection area larger than 314 mm² for detecting electrons or ions;a multiplication factor larger than 4.0 × 10⁷. | Annex 4, 39 | 8, 9 | transitional case | |
| 92 | Lead as a thermal stabiliser in polyvinyl chloride (PVC) used as base material in amperometric, potentiometric and conductometric electrochemical sensors which are used in in-vitro diagnostic medical devices for the analysis of blood and other body fluids and body gases. | Annex 4, 41 | 8iv | 31st March 2022 | |
| 93 | Mercury in electric rotating connectors used in intravascular ultrasound imaging systems capable of high operating frequency (> 50 MHz) modes of operation. | Annex 4, 42 | 8x, 9x | 30th June 2026 | |
| 94 | Cadmium anodes in Hersch cells for oxygen sensors used in industrial monitoring and control instruments, where sensitivity below 10 ppm is required. | Annex 4, 43 | 9ind | 15th July 2023 | |
| 95 | Cadmium in radiation tolerant video camera tubes designed for cameras with a centre resolution greater than 450 TV lines which are used in environments with ionising radiation exposure exceeding 100 Gy/hour and a total dose in excess of 100kGy. | Annex 4, 44 | 8x, 9 | 31st March 2027 | |
| 96 | Lead diazide, lead styphnate, lead dipicramate, orange lead (lead tetroxide), lead dioxide in electric and electronic initiators of explosives for civil (professional) use and barium chromate in long time pyrotechnic delay charges of electric initiators of explosives for civil (professional) use | Annex 3, 45 | 11 | 20th April 2026 | |
| 97 | Bis(2-ethylhexyl) phthalate (DEHP) in ion selective electrodes applied in point of care analysis of ionic substances present in human body fluids and/or in dialysate fluids. | Annex 4, 45 | 8 | 21st July 2028 | |
| 98 | Bis(2-ethylhexyl) phthalate (DEHP) in plastic components in magnetic resonance imaging (MRI) detector coils. | Annex 4, 46 | 8 | 1st January 2024 | |
| 99 | Bis(2-ethylhexyl) phthalate (DEHP), butyl benzyl phthalate (BBP), and diisobutyl phthalate (DIBP) in spare parts recovered from and used for the repair or refurbishment of medical devices, including in vitro diagnostic medical devices, and their accessories, provided that the reuse takes place in auditable closed-loop business-to-business return systems and that each reuse of parts is notified to the customer. | Annex 4, 47 | 8 | 21st July 2028 | |
| No. | Application | Categories of EEE to which exemption applies | |||
| --- | --- | --- | |||
| 1 | Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC, where used in spare parts for EEE placed on the market before 1st January 2013. | all categories | |||
| 2 | Cadmium and its compounds in one shot pellet type thermal cut-offs, where used in spare parts for EEE placed on the market before 1st January 2012. | all categories | |||
| 3 | Lead used in C-press compliant pin connector systems, where used in spare parts for EEE placed on the market before 24th September 2010. | all categories | |||
| 4 | Lead used in other than C-press compliant pin connector systems, where used in spare parts for EEE placed on the market before 1st January 2013. | all categories | |||
| 5 | Lead as a coating material for the thermal conduction module C-ring, where used in spare parts for EEE placed on the market before 24th September 2010. | all categories | |||
| 6 | Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight, where used in spare parts for EEE placed on the market before 1st January 2011. | all categories | |||
| 7 | Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm and less, where used in spare parts for EEE placed on the market before 24th September 2010. | all categories | |||
| 8 | Cadmium in phosphor coatings in image intensifiers for X-ray images, in spare parts for X-ray systems placed on the market before 1st January 2020. | 8, 9 | |||
| 9 | Hexavalent chromium in alkali dispensers used to create photocathodes in X-ray image intensifiers, where used in spare parts for X-ray systems placed on the market before 1st January 2020. | 8, 9 | |||
| 10 | Lead used in other than C-press compliant pin connector systems, where used in spare parts for industrial monitoring and control instruments placed on the market before 1st January 2021. | 9ind | |||
| 11 | Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC, where used in spare parts for industrial monitoring and control instruments placed on the market before 1st January 2021. | 9ind |
PART 4 — Internal Production Control Procedure
25
The internal production control procedure is a conformity assessment procedure whereby a manufacturer must ensure EEE is manufactured in compliance with the technical documentation and with the applicable requirements of these Regulations.
26
The technical documentation must—
- (a) make it possible to assess the EEE's conformity with the applicable requirements of these Regulations, and must include an adequate analysis and assessment of the risks;
- (b) specify the applicable requirements and cover, as far as relevant for the assessment, the design, manufacture and operation of the EEE;
- (c) contain, where applicable, at least the following elements—
- (i) a general description of the EEE;
- (ii) conceptual design and manufacturing drawings and schemes of components, sub-assemblies;
- (iii) descriptions and explanations necessary for the understanding of those drawings and schemes, and the operation of the EEE;
- (iv) a list of the designated standards applied in full or in part (where applicable specifying the parts which have been applied);
- (v) where designated standards have not been applied, descriptions of the solutions adopted to meet the essential requirements, including a list of other relevant technical specifications applied;
- (vii) results of design calculations made, examinations carried out and
- (viii) test reports.
SCHEDULE 1A — Declaration of conformity
1
Declaration of conformity (unique identification of the EEE):
2
Name and address of the manufacturer or, where applicable, authorised representative:
3
This declaration of conformity is issued under the sole responsibility of the manufacturer (or installer):
4
Object of the declaration (identification of EEE allowing traceability: it may include a photograph, where appropriate):
5
The object of the declaration described above is in conformity with relevant statutory requirements:
6
Where applicable, references to the relevant designated standards used or references to the technical specifications in relation to which conformity is declared:
7
Additional information:
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