The Export of Goods (Control) Order 1987

Type Statutory-Instrument
Publication 1987-11-26
State In force
Department Queen's Printer of Acts of Parliament
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IL1301 Equipment specially designed for the production of nickel-, cobalt-or iron-base alloys in crude or semi-fabricated forms having strengths superior to the AISI 300 series (as at May 1982) at temperatures higher than +922 K (+649°C) under severe environmental conditions A
except
1 Electric arc and induction furnaces (other than vacuum induction furnaces used in the production of powders of the aforesaid alloys), basic oxygen furnaces and re-melting equipment using other techniques for the production of carbon steels, low alloy steels and stainless steels;
2 Degassing equipment used for the production of carbon steels, low alloy steels and stainless steels;
3 Extrusion presses, hot and cold rolling mills and swaging and forging machines;
4 Decarburizing, annealing and pickling equipment;
5 Surface-finishing equipment; and
6 Slitting and cutting equipment.
(Note as to electric vacuum furnaces, Group 3C above and as to extrusion presses and hot and cold rolling mills, subsequent entries in this Group.)
IL1305 Metal rolling mills, the following–
1 Isothermal rolling mills, except those capable of operating only at ambient temperatures A
2 Other mills specially designed or redesigned for the rolling of metals and alloys with a melting point exceeding 1,900°C A
3 Specially designed components, accessories and controls for the mills specified in heads (1) and (2) above, and specially designed software therefor A
(Note exception (3) in the entry in this Group relating to equipment specially designed for the production of certain nickel-, cobalt-or iron-base alloys.)
IL1312 Presses the following–
1 Isostatic presses having either of the following characteristics–
a capable of achieving a maximum working pressure of 138 MPa (20,000 p.s.i.) or greater and possessing a chamber cavity with an inside diameter in excess of 406 mm (16 inches); or A
b having a controlled thermal environment within the closed cavity and possessing a working cavity with an inside diameter of 127 mm (5 inches) or more A
2 Specially designed dies and moulds (except those used in isostatic presses operating at ambient temperatures), components, accessories and control equipment for the presses specified in head (1)(a) and (b) above, and specially designed software for the use of such presses and their control equipment and components A
In this entry isostatic presses are presses capable of pressurising a closed cavity through various media (gas, liquid, solid particles etc) to create equal pressure in all directions within the cavity upon a workpiece or material.
(Note exception (3) in the entry in this Group relating to equipment specially designed for the production of certain nickel-, cobalt-or iron-base alloys.)
IL1352 Nozzles, dies and extruder barrels specially designed for the processing of any of the materials specified in sub-head (2)(b) of the entry in Group 3I relating to fluorocarbon compounds A
IL1353 Machinery and apparatus specially designed for the manufacture of cable and optical fibres specified in the entry in Group 3F relating to cable and wire A
IL1354 Equipment designed for the manufacture or testing of printed circuit boards, the following–
1 Equipment specially designed for removal of resists or printed circuit board materials by dry (e.g. plasma) methods A
2 Computer-aided design (CAD) equipment for printed circuit boards, having any of the following functions–
a generation of artwork design with an interactive capability A
b generation of test string lists for multi-layer boards A
c generation of data or programmes for stored-programme controlled printed circuit board drilling equipment A
d generation of data or programmes for stored-programme controlled printed circuit board shaping and profiling equipment A
e generation of data for control of the sequencing of processess of the equipment for printed circuit board manufacture covered by head (3) of this entry A
3 High-speed automated continuous panel processors for plating capable of delivering 860 A/mu22 (80A/ftu22) or more of plate current A
except processors specially designed for plating tab (edge) connectors.
4 Stored-programme controlled inspection equipment for the detection of defects in printed circuit boards using optical pattern comparison or other machine scanning techniques A
5 Stored-programme controlled electrical test equipment for the identification of open and short circuits on bare printed circuit boards, capable of–
a continuity testing (4 ohm or less) at a rate of 2,500 or more measurements per second A
or
b high voltage testing (50 volts or more) at a rate of 10,000 or more measurements per minute A
6 Stored-programme controlled multispindle drills and routers having any of the following characteristics–
a absolute positioning accuracy of .26610 micrometers (0.0004 inch) or better A
b minimum time needed for drill bit changes of 5 seconds or less A
c X and Y positioning speeds of 0.125 metres per second (300 inches per minute) or higher for drilling or for routing A
7 Stored-programme controlled cyclic voltametric stripping equipment specially designed for printed circuit board plating bath monitoring and analysis A
8 Specially designed components and accessories and specially designed software for the equipment specified in heads (1) to (7) above (inclusive) A
except equipment with controls using any of the following–
a cams and other purely mechanical means;
b switches, including thumbwheel switches;
c plugboards;
d on-off and analogue controllers;
e diode matrices; or
f punched paper tape controllers without a capability to compute, manipulate, or store and re-run programme data.
In this entry the term “stored-programme-controlled” refers to a control using instructions stored electronically which a processor can execute in order to direct the performance of predetermined functions.
(Note head (2) of the entry in Group 3F relating to lasers and laser systems.)
IL1355 Equipment for the manufacture or testing of electronic components and materials, the following–
1 Equipment specially designed for the manufacture or testing of electron tubes specified in the entries in Group 3F relating to electronic cathode-ray tubes, cold cathode tubes, triggered spark gaps, thyratrons, electron tubes or valves, and of optical elements specified in the entry in Group 3F relating thereto A
2 Equipment specially designed for the manufacture or testing of semiconductor devices, integrated circuits and assemblies, and systems incorporating or having the characteristics of such equipment, the following–
a equipment for producing polycrystalline silicon specified in the entry in Group 3I relating to compounds and materials, having a purity of 99.99% or greater in the form of rods (ingots, boules), pellets, sheets, tubes or small particles A
b equipment specially designed for purifying or processing III-V or II-VI semiconductor materials specified in the entry in Group 3I relating to compounds and materials A
c crystal pullers, furnaces and gas systems, the following–
i types with specially designed stored-programme-controlled temperature, power input or gas, liquid or vapour flow A
ii diffusion, oxidation and annealing furnaces for operation at pressures above 1 atmosphere (nominal) A
iii annealing or re-crystallizing equipment other than constant temperature furnaces employing high rates of energy transfer capable of processing wafers at a rate greater than 50 square centimetres per minute A
iv plasma-enhanced or photo-enhanced chemical reactor equipment A
v equipment for automatic control of crystal taper and diameter A
except taper and diameter control mechanisms using any of the following techniques–
a radiation pyrometers;
b thermocouples;
c RF power sensors; or
d mass weighing, without digital or anomaly control permitting the growth of semi-conductors. vi crystal pullers having any of the following characteristics– A
a rechargeable without replacing the crucible containers;
b capable of operation at pressures above or below 10u25 pascals (1 atomosphere absolute);
c capable of pulling crystals of a diameter greater than 76.2 mm;
d specially designed to minimise convection currents in the melt by the use of magnetic fields or multiple crucibles; or
e capable of pulling sheet or ribbon crystals.
vii vacuum induction-heated zone-refining equipment for operation at a pressure of 0.01 pascal or less A
d equipment for epitaxial growth having any of the following characteristics– A
i operation at pressures below 10u25 pascals (1 atmosphere absolute);
ii stored-programme-controlled;
iii rotating vertical-support radiant-heated reactors;
iv specially designed for processing bubble memories;
v metal-organic chemical vapour deposition reactors; or
vi for liquid phase epitaxy.
e molecular beam epitaxial growth equipment A
f magnetically enhanced sputtering equipment A
g equipment designed for ion implantation or ion-enhanced or photo-enhanced diffusion A
h equipment for selective or non-selective removal by dry methods of passivation layers, dielectrics, semiconductor materials, resists or metals A
except horizontal, cylindrical, plasma etchers without stored-programme-control end-point detection, automatic loading or rotating mechanisms and not having the capability for parallel plate etching as used in semiconductor device manufacture or vacuum sputtering equipment designed to operate in the sputter-etch mode
i equipment for semiconductor device fabrication operating below 10u25 pascals (1 atmosphere absolute) for the chemical vapour deposition of oxides, nitrides, metals, and polysilicon, except reactive-sputtering equipment A
j electron beam systems (including scanning electron microscopes) capable of mask making or semiconductor device processing and having any of the following characteristics– A
i electrostatic beam deflection;
ii shaped, non-Gaussian beam profile;
iii beam blanking capability;
iv digital-to-analogue conversion accuracy greater than 12 bit;
v digital-to-analogue conversion rate greater than 3 MHz; or
vi target-to-beam position feed-back control precision of 1 micrometre or finer;
except
a electron beam deposition systems; and
b scanning electron microscopes having beam blanking capability which are equipped for Auger analysis.
k surface-finishing equipment, specially designed for the processing of semiconductor wafers and having any of the following characteristics– A
i waxless or non-adhesive mounting;
ii double-sided simultaneous polishing or lapping;
iii capable of polishing and lapping wafers greater than 76.2 mm in diameter; or
iv lapping or polishing in two stages on the same machine.
l interconnection equipment which may include common single or multiple vacuum chambers specially designed to permit the integration of equipment specified in this entry into a complete system A
3 Masks, mask substrates, Mask-making equipment and image transfer equipment for the manufacture of the devices and components specified in head (2) above, the following–
a finished masks, reticles and designs therefor A
b hard surface (e.g. chromium, silicon, iron oxide) coated substrates (e.g. glass, quartz, sapphire) for the preparation of masks having dimensions greater than 76.2 mm by 76.2 mm A
c computer-aided design (CAD) equipment for transforming schematic or logic diagrams into designs for producing semiconductor devices or intergrated circuits, having any of the following functions– A
i storage of pattern cells for sub-division of integrated circuits;
ii scaling, positioning or rotation of pattern cells;
iii interactive graphic capabilities;
iv design rule and circuit checking; or
v circuit layout modification of the arrangement of the elements
d mask fabrication machines using photo-optical methods, the following–
i step and repeat cameras capable of producing arrays larger than 63.5 mm by 63.5 mm, or capable of producing a single exposure larger than 3.75 mm by 3.75 mm in the focal plane, or capable of producing useful line widths of 3.5 micrometres or less A
ii pattern generators specially designed for the generation or manufacture of masks or the creation of patterns in photosensitive layers and with placement precision finer than 10 micrometres A
iii mask fabrication equipment containing automatic adjustment of focus or adjustment of the mask material into the focal plane A
iv equipment and holders for altering masks or reticles to remove defects A
e mask, reticle or pellicle inspection equipment, the following–
i for comparison with a precision of 0.75 micrometre or finer over an area of 63.5 mm by 63.5 mm or greater A
ii stored-programme-controlled equipment with a resolution of 0.25 micrometre or finer and with a precision of 0.75 micrometre or finer over a distance in one or two co-ordinates of 63.5 mm or greater A
iii stored-programme-controlled defect inspection equipment, except conventional scanning electron microscopes not specially designed or instrumented for automatic pattern inspection A
f align and expose equipment using photo-optical methods, including projection image transfer equipment, capable of performing any of the following functions– A
i Production of a useful pattern size of less than 5 micrometres;
ii alignment with a precision finer than 1 micrometre;
iii field coverage greater than 76.2 mm by 76.2 mm;
iv wafer backside alignment;
v automatic alignment by the sensing of patterns or index marks on the substrate; or
vi projection image transfer for the processing of slices (wafers) of 50.8 mm or greater in diameter (in the case of equipment except non contacting (proximity) image transfer equipment).
g electron beam, ion beam, or X-ray equipment for projection image transfer A
h photo-optical or non-photo-optical step and repeat or partial field equipment for the transfer of the image on to the wafer A
i mask contact image transfer equipment for imaging a field greater than 76.2 mm by 76.2 mm A
4 Stored-programme-controlled inspection equipment for the detection of defects in processed wafers, substrates or chips using optical pattern comparison or other machine scanning techniques, except conventional scanning electron microscopes not specially designed or instrumented for automatic pattern inspection A
5 Specially designed stored-programme-controlled measuring and analysis equipment, the following–
a specially designed for the measurement of oxygen or carbon content in semi-conductor materials A
b equipment for concurrent etching and doping profile analysis (employing capacitance-voltage or current-voltage analysis techniques) A
c equipment for line-width measurement with a resolution of 1.0 micrometre or finer A
d specially designed flatness measurement instruments capable of measuring deviations from flatness of 10 micrometres or less with a resolution of 1.0 micrometre or finer A
6 Equipment for the assembly of integrated circuits specified in head (2) above, the following–
a stored-programme-controlled die (chip) mounters and bonders with a positioning accuracy finer than 50 micrometres or incremental steps finer than 6.4 micrometres A
b stored-programme-controlled wire bonders and welders for performing consecutive bondror performing consecutive bonding operations A
c equipment for producing multiple bonds in a single operation, including but not limited to beam lead bonders, chip carrier bonders and tape bonders A
d semi-automatic or automatic hot cap sealers, in which the cap is heated locally to a higher temperature than the body of the package, specially designed for ceramic microcircuit packages specified in the entry in Group 3F relating to electronic component assemblies and which have a throughput equal to or greater than one package per minute or thermal compression bonders (also known as nail head bonders) A
except, general purpose resistance type spot welders
7 Stored-programme-controlled wafer probing equipment having any of the following characteristics– A
a positioning accuracy finer than 50 micrometres, or incremental steps finer than 6.4 micrometres;
b individual die location read-out (X–Y position information) during testing;
c capability of testing devices having more than a total of 24 terminals; or
d automatic slice (wafer) alignment.
8 Test equipment, except test equipment which is not of a general purpose nature and which is specially designed for, and dedicated to, testing assemblies or a class of assemblies for home and entertainment applications or testing electronic components, assemblies, sub-assemblies and microcircuits not specified in the entry in Group 3F relating to electronic component asemblies provided they do not incorporate computing facilities with user-accessible programming capabilities, the following–
a stored-programme-controlled equipment specially designed for testing discrete semiconductor devices and unencapsulated dice, capable of performing any of the following functions– A
i measurement of time intervals of less than 10 nanoseconds;
ii measurement of parameters (such as fd2T, S parameters, noise figure) at frequencies greater than 250 MHz;
iii resolution of currents of less than 100 picoamperes;
iv measurement of spectral response at wavelengths outside the range from 450 to 950 nanometres.
b stored-programme-controlled equipment specially designed for testing integrated circuits and assemblies thereof, capable of performing any of the following functions– A
i functional (truth table) testing at a pattern rate greater than 2 MHz;
ii resolution of currents of less than 1 nanoampere;
iii testing of integrated circuits (not mounted on circuit boards) in packages having more than a total of 24 terminals, except equipment specially designed for and dedicated to the testing of integrated circuits other than those specified in the entry in Group 3F relating to electronic components; or
iv measurements of rise times, fall times and edge placement times with a resolution of less than 20 nanoseconds.
c equipment specially designed for determining the performance of focal-plane arrays at wavelengths greater than 1,200 nanometres, using stored-programme-controlled measurements or computer-aided evaluation and having any of the following characteristics– A
i using scanning light spot diameters of less than 0.12 mm;
ii designed for measuring photosensitive performance parameters and for evaluating frequency response, modulation transfer function, uniformity of responsitivity or noise;
iii designed for eavaluating arrays capable of creating images of greater than 32 × 32 line elements.
d specially designed for bubble memories A
9 Class 10 filters capable of providing an environment of 10 or fewer particles of 0.3 micrometre or more per cubic foot and filter materials therefor A
10 Pellicles made of polycrystalline silicon as defined in the entry on Group 3I relating thereto A
11 Specially designed components, accessories and software for the equipment specified in heads (1) to (10) above (inclusive) except quartz crucibles specially designed for equipment specified in head (2) above A
12 Software for the design of semiconductor devices or microcircuits which–
a performs any of the functions in sub-head 3(c) above A
b can be used for transient analysis A
c can be used for logic analysis or logic checking A
d can be used for automatic routing or cell placement A
e can be used for the generation of test vectors A
f can be used for process simulation A
In this entry–
“assembly” means a number of components (ie circuit elements, discrete components, microcircuits) connected together to perform a specific function or functions, replaceable as an entity (and normally capable of being disassembled);
“discrete semiconductor devices” include diodes, transistors, thyristors, photocells and solar cells;
“integrated” means a device in which a number of passive and active circuit elements are considered as indivisibly associated on or within a continuous structure to perform the function of a circuit;
“magnetically enhanced” refers to equipment incorporating a cathode assembly having an integral structure for enhancing plasma intensity;
“masks” includes those used in electron beam lithography, X-ray lithography, and for ultraviolet lithography as well as the usual ultraviolet and visible photo-lithography; and
“stored-programme-controlled” refers to a control using instructions stored electronically which a processor can execute in order to direct the performance of predetermined functions.
IL1356 Equipment specially designed or incorporating modifications for the continuous coating of polyester base magnetic tape used as a recording medium specified in sub-head (4) of the entry in Group 3G relating to recording and reproducing equipment, and specially designed components therefor A
except general purpose continuous coating equipment.
IL1357 Equipment for the production of fibres specified in the entries in Group 3I relating to fibrous and filamentary materials or their composites, the following–
1 Filament winding machines of which the motions for positioning, wrapping and winding fibres are co-ordinated and programmed in three or more axes, specially designed to fabricate composite structures or laminates from fibrous and filamentary materials; and co-ordinating and programming controls therefor A
2 Tape-laying machines of which the motions for positioning and laying tape and sheets are co-ordinated and programmed in two or more axes, specially designed for the manufacture of composite airframes and missile structures A
3 Interlacing machines, including adapters and modification kits, for weaving, interlacing or braiding fibres or fabricate composite structures, except textile machinery which has not been modified for the above end-uses A
4 Specially designed or adapted equipment for the production of fibrous and filamentary materials specified in heads (1) and (2) of the entry in Group 3I relating to fibrous and filamentary materials, the following–
a equipment for converting polymeric fibres (such as polyacrylonitrile, rayon, or polycarbosilane) including special provision to strain the fibre during heating A
b equipment for the vapour deposition of elements or compounds on heated filamentary substrates A
c equipment for the wet-spinning of refractory ceramics (such as aluminium oxide) A
5 Specially designed or adapted equipment for special fibre surface treatment or for producing prepregs and preforms specified in head (3) of the entry in Group 3I relating to fibrous and filamentary materials A
Equipment covered by this head includes, but is not limited to, rollers, tension stretchers, coating equipment, cutting equipment and clicker dies.
6 Specially designed components and accessories and specially designed software, for equipment specified in heads (1) to (5) above (inclusive) A
Specially designed or adapted components and accessories for the machines covered by this entry include, but are not limited to, moulds, mandrels, dies, fixtures and tooling for the preform pressing, curing, casting, sintering or bonding of composite structures, laminates and manufactures thereof covered by the entry therefor in Group 3I.
IL1358 Equipment specially designed for the manufacture or testing of devices and assemblies included in heads (2) to (5) (inclusive) of the entry in Group 3G relating to materials composed of crystals having spinel, hexagonal, orthorhombic or garnet crystal structures, and thin film devices and for the manufacture or testing of magnetic recording media, other than tape, specified in head (4) of the entry in Group 3G relating to recording or reproducing equipment, the following–
1 Equipment for the manufacture of single and multi-aperture forms specified in heads (2) to (4) (inclusive) of the entry in Group 3G relating to materials composed of crystals, and single aperture forms of ferrites having a maximum dimension less than 0.76 mm, the following–
a automatic presses for the production of the specified forms A
b press dies for the production of the specified forms A
c automatic equipment for the monitoring, grading, sorting, exercising or testing of the specified forms A
2 Equipment for the manufacture of thin film devices and associated equipment, the following–
a equipment for the manufacture of thin film memory storage or switching devices having square hysteresis loops A
b automatic equipment for the monitoring, grading, sorting, exercising or testing of thin film (including plated wire and plated rods) memory storage or switching devices A
3 Automatic equipment for monitoring, exercising or testing assemblies of any devices specified in heads (2) to (4) (inclusive) of the entry in Group 3G relating to materials composed of crystals A
4 Equipment which incorporates specially designed modifications for the application of magnetic coating to flexible disk recording media with a packing density exceeding 2460 bit per cm (6250 bit per inch) A
except general purpose coating equipment.
5 Equipment specially designed for the application of magnetic coating to non-flexible (rigid) disk type recording media specified in head (4) of the entry in Group 3G relating to recording or reproducing equipment A
6 Stored-programme-controlled equipment for monitoring, grading, exercising or testing recording media other than tape specified in head (4) of the entry in Group 3G relating to recording or reproducing equipment A
7 Specially designed components and software for the equipment specified in heads (1) to (5) (inclusive) A
IL1359 Specially designed tooling and fixtures for the manufacture of fibre-optic connectors and couplers specified in head 2(f) of the entry in Group 3F relating to cable and wire A
IL1360 Stored-programme-controlled equipment capable of automatic X-ray orientation and angle correction of double-rotated stress-compensated quartz crystals and specified in the entry in Group 3G relating to quartz crystals having piezo-electric qualities, with a tolerance of 10 seconds of arc maintained simultaneously in both angles of rotation A
IL1361 Test facilities and equipment for the design or development of aircraft or gas turbine aero-engines, the following–
1 Supersonic (Mach 1.4 to Mach 5), hypersonic (Mach 5 to Mach 15) and hypervelocity (above Mach 15) wind tunnels, except those specially designed for educational purposes and having a test section size (measured internally) of less than 25 cm A
2 Devices for simulating flow-environments of Mach 5 and above, including but not limited to hot shot tunnels, plasma arc tunnels, shock tubes, shock tunnels, gas tunnels and light gas guns A
3 Wind tunnels and devices, other than two-dimensional sections, having unique capabilities for simulating Reynolds number flow in excess of 25 × 10u26 at transonic velocities A
4 Automated control systems, instrumentation (including sensors) and automated data-acquisition equipment, specially designed for use with wind tunnels and devices specified in heads (1) to (3) above (inclusive) A
5 Models, specially designed for use with wind tunnels, of aircraft, helicopters, airfoils, spacecraft, space launch vehicles or rockets specified in the entries in Groups 1 and 3E relating thereto or of surface-effect vehicles specified in head (2) of the entry in Group 3E relating to ships A
6 Specially designed electromagnetic interference and electromagnetic pulse simulators A
7 Specially designed test facilities and equipment for the development of gas turbine aero-engines and components, the following–
a special test facilities capable of applying dynamic flight loads, measuring performance or simulating the design operating environments for rotating assemblies or aero-engines A
b test facilities, test rigs and simulators for measuring combustion system and hot gas flow path performance, heat transfer and durability for static assemblies and aero-engine components A
c specially designed test rigs, equipment or modified gas turbine engines which are used for development of gas turbine aero-engine internal flow systems (gas path seals, air-oil seals and disc cavity flow fields) A
8 Specially designed components, accessories and software for the facilities and equipment specified in heads (1) to (7) above (inclusive) A
IL1362 Vibration test equipment and ancillary equipment therefor, the following–
1 Vibration test equipment using digital-control techniques and specially designed ancillary equipment and software therefor A
except
a mechanical and pneumatic exciters (thrusters);
b other individual exciters (thrusters) with a maximum thrust of less than 100 kN;
c vibrometers;
d analogue equipment; and
e other ancillary equipment unless falling within a description in an entry in Groups 3F or 3G.
2 High intensity acoustic test equipment having either of the following characteristics–
a capable of producing an overall sound pressure level of 140 dB or greater (referenced to 2 × 10u2–u25 Nmu22 A
or
b having a rated output of 4 kW or greater A
and specially designed ancillary equipment and software therefor A
except
i analogue equipment; and
ii other ancillary equipment unless falling within a description in an entry in Groups 3F or 3G.
3 Ground vibration (including modal survey) test equipment which uses digital-control techniques, and specially designed ancillary equipment and software therefor A
except
a analogue equipment; and
b other ancillary equipment unless falling within a description in an entry in Groups 3F or 3G.
IL1363 Specially designed water tunnel equipment, components, accessories and data bases for the design and development of vessels, the following–
1 Automated control systems, instrumentation (including sensors) and data acquisition equipment specially designed for water tunnels A
2 Automated equipment to control air pressure acting on the surface of the water in the test section during the operation of the water tunnel A
3 Components and accessories for water tunnels, the following–
a balance and support systems A
b automated flow or noise measuring devices A
c models of hydrofoil vessels, surface-effect vehicles and specially designed equipment and components specified in heads (1), (2), (4) of the entry in Group 3E relating to ships, for use in water tunnels A
4 Data bases generated by use of equipment specified in heads (1) to (3) above (inclusive) A
5 Specially designed software for the equipment, components, accessories and data bases specified in this entry A
IL1364 Machinery and equipment for the manufacture of hydrofoil vessel and surface-effect vehicle structures and components, the following–
1 Specially designed equipment for manufacturing anisotropic, orthotropic or sandwich structures specified in sub-head (12)(c) of the entry in Group 3E relating to ships A
2 Specially designed equipment for the production and testing of flexible materials for skirts, seals, air curtains, bags and fingers for surface-effect vehicles A
3 Specially designed equipment for the production of water-screw propellers specified in head (13) of the entry in Group 3E relating to ships A
4 Specially designed equipment for the production, dynamic balancing and automated testing and inspection of lift fans for surface-effect vehicles A
5 Specially designed equipment for the production of water-jet propulsion pumps rated at 3,000 hp or more, or multi-pump system equivalents thereof A
6 Specially designed equipment for the production, dynamic balancing and automatic testing of sectored disc and concentric-drum rotors for DC homopolar machines A
7 Specially designed components and accessories for the equipment specified in heads (1) to (6) above (inclusive) A
IL1365 Equipment specially designed for in-service monitoring of acoustic emissions in airborne vehicles, or in under-water vehicles specified in the entry in Group 3E relating to deep submergence vehicles, capable of discriminating acoustic emissions related to crack growth from innocuous noise sources and capable of spatial location of the crack, and specially designed components, accessories and software therefor A
IL1370 Machine tools for generating optical quality surfaces and specially designed components, accessories and software therefor, the following–
1 Turning machines using a single point cutting tool and having all of the following characteristics A
a slide positioning accuracy finer than 0.0005 mm per 300 mm of travel, TIR (peak-to-peak);
b slide positioning repeatability finer than 0.00025 mm per 300 mm of travel, TIR (peak-to-peak);
c spindle runout (radial and axial) less than 0.0004 mm TIR (peak-to-peak);
d angular deviation of the slide movement (yaw, pitch and roll) less than 2 seconds of arc (peak-to-peak) over full travel; and
e slide perpendicularity less than 0.001 mm per 300 mm of travel, TIR (peak-to-peak).
In this entry evaluation of performance shall be made under conditions yielding the most accurate values, including but not limited to the incorporation of control systems which permit mechanical, electronic or software compensation.
2 Fly cutting machines having both of the following characteristics A
a spindle run-out (radial and axial) less than 0.0004 mm TIR (peak-to-peak);
b angular deviation of slide movement (yaw, pitch and roll) less than 2 seconds of arc (peak-to-peak) over full travel.
3 Specially designed components, the following–
a spindle assemblies, consisting of spindles and bearings as a minimum assembly, except those assemblies with axial and radial axis motion measured along the spindle axis in one revolution of the spindle equal to or greater than 0.0008 mm TIR (peak-to-peak) A
b linear induction motors used as drives for slides having all of the following characteristics– A
i stroke greater than 200 mm;
ii nominal force rating greater than 45 N; and
iii minimum controlled incremental movement less than 0.001 mm.
4 Specially designed accessories, the following–
single point diamond cutting tool inserts having all of the following characteristics– A
a flawless and chip-free cutting edge when magnified 400 times in any direction;
b cutting radius between 0.1 mm and 5 mm; and
c cutting radius out-of-roundness less than 0.002 mm TIR (peak-to-peak).
IL1371 Anti-friction bearings and components therefor, the following–
1 Ball and roller bearings having an inner bore diameter of 10 mm or less and having tolerances specified in Table 2 (EP5) of British Standard 292: 1969, or better and either of the following characteristics–
a made of any material A
except
i low carbon steel containing not more than 0.4% of carbon and no other elements other than those present as impurities or in such low quantities as not to modify the basic characteristics of the steel;
ii high carbon chromium steel types Steel-534A99 and 535A99 as specified in British Standard 970: Part 2: 1970, or equivalent types normally used in the manufacture of ball or roller bearings;
iii nickel-molybdenum steel type Steel-665M17 as specified in British Standard 970: Part 3: 1971, or equivalent types normally used in the manufacture of ball or roller bearings; and
iv stainless steel type AISI-440C (SAE-51440C) or equivalent types normally used in the manufacutre of ball or roller bearings; or
b processed by heat treatment for the purpose of stabilising such bearings for use at normal temperatures over 150°C A
2 Ball and roller bearings (except separable ball bearings and thrust ball bearings) having an inner bore diameter exceeding 10 mm and having tolerances specified in Table 3 (EP7) of British Standard 292: 1969, or better, and either of the characteristics in sub-heads (1)(a) or (1)(b) of this entry A
3 Ball and roller bearings having tolerances better than those specified in Table 3 (EP7) of British Standard 292: 1969 A
4 Gas-lubricated foil bearings A
5 Components of ball and roller bearings, usable only for bearings specified in heads (1) to (3) above (inclusive), the following:
outer rings, inner rings, retainers, balls, rollers and sub-assemblies A
This entry also covers bearings having tolerances specified in imperial measures which are equivalent to the metric tolerances specified in British Standard 292: 1969.
This entry does not cover hollow bearings.
IL1385 Specially designed production equipment for compasses, gyroscopes (gyros), acclerometers and inertial equipment specified in the entry in Group 3E relating to compasses, gyroscopes (gyros), accelerometers and inertial equipment A
IL1391 Robots, robot controllers and robot end-effectors, the following–
1 Robots having any of the following characteristics:
a capable of employing feedback information on-line (real-time) from one or more sensors to generate programmes or modify programmed instructions on numerical programme data A
except those using information derived only from sensors used to measure–
i the velocity, position (other than inertial position measuring systems), drive motor current, voltage, fluid or gas pressure or temperature of the robot;
ii through-the-arc current (or voltage) for weld seam tracking; or
iii binary or scalar values for–
a position, via photo-electric, inductive or capacitive proximity sensors;
b tool drive motor voltage or current or hydraulic/pneumatic pressure for determination of force or torque; and
c external safety functions.
b specially designed to comply with national safety standards applicable to explosive munitions environments A
c incorporating means of protecting hydraulic lines against externally induced punctures caused by ballistic fragments and designed to use hydraulic fluids with flash points higher than 839 K (566°C) A
d specially designed for under water use A
e operable at altitudes exceeding 30,000 metres A
f specially designed for outdoor applications and meeting military specifications therefor A
g specially designed or rated for operating in an electromagnetic pulse (EMP) environment A
h specially designed or rated as radiation-hardened beyond that necessary to withstand normal industrial (other than nuclear industry) ionising radiation A
i equipped with robot manipulator arms which contain titanium-based alloys specified in the entry in Group 3H relating thereto or fibrous and filamentary materials specified in the entry in Group 3I relating thereto A
j equipped with precision measuring devices specified in the entry in Group 3F relating to precision linear and angular measuring systems A
k specially designed to move autonomously its entire structure through three-dimensional space in a simultaneously coordinated manner except systems in which the robot moves on a fixed track A
2 Electronic controllers having any of the following characteristics:
a controllers specially designed to be part of a robot specified in sub-heads (b) to (h) inclusive, (j) or (k) of head (l) above A
b minimum programmable increment less (finer) than 0.001 mm per linear axis A
c having more than one integral interface which meets or exceeds ANSI/IEEE standard 488-1978, IEC publication 625-1 or any equivalent standard for parallel data exchange A
d capable of being programmed by means other than lead-through, key-in or teach-pendant techniques A
e word size exceeds 16 bit (excluding parity bits) A
f incorporating interpolation algorithms for an order of interpolation higher than linear or circular A
g permitting on-line (real-time) generation or modification of the programmed path, velocity and functions other than the following– A
i manual velocity override;
ii fixed linear or rotary axis offset;
iii manual robot path editing (including manual path compensation) excluding source language used to programme automatically the robot path, velocity or function;
iv branching to pre-programmed modification of the robot path, velocity or function;
v fixed cycles;
vi key-in or teach-in modifications.
3 End-effectors having any of the following characteristics:
a equipped with one or more sensors, except sensors used to measure the parameters or values specified in sub-heads (a)(i), (ii) or (iii) of head (1) above; A
b having integrated computer-aided data processing A
except those using sensors used to measure the parameters or values specified in sub-heads (a)(i), (ii) or (iii) of head (1) above;
c equipped with an integral interface which meets or exceeds ANSI/IEEE Standard 488-1978, IEC publication 625-1 or any equivalent standard for parallel data exchange A
d having any of the characteristics specified in sub-heads (b) to (h) inclusive or (j) of head (l) above A
4 Specially designed components and specially designed software for the equipment specified in heads (1) to (3) above (inclusive) A
In this entry–
“robot” means a manipulation mechanism which is reprogrammable, multifunctional and capable of positioning or orientating material, parts, tools or special devices through variable movements in three-dimensional space. It incorporates two or more closed or open loop servo-devices (including stepping motors) and is reprogrammed by means of the teach/playback method, an electronic computer or a programmable logic controller;
“end-effectors” include grippers, active tool units (being devices for applying motive power, process energy or sensing to the workpiece) and any other tooling that is attached to the baseplate on the end of the robot’s manipulator arms; and
“sensor” means a detector of a physical phenomenon, the output of which (after conversion into a signal that can be interpreted by a controller) is able to generate programmes or modified programmed instructions or numerical programme data, and includes sensors with machine vision, infrared imaging, acoustical imaging, tactile feel, inertial position measuring, optical or acoustic ranging or force or torque measuring capabilities.
IL1399 Software for automatically controlled industrial systems to produce assemblies or discrete parts (except software in machine executable form for industrial sectors other than nuclear, aerospace, shipbuilding, heavy vehicles, machine building, microelectronics and electronics), possessing all of the following characteristics– A
1 Specially designed for automatically controlled industrial systems which include at least eight pieces of any combination of items of the following equipment–
a a machine tool or dimensional inspection machine specified in the entries in Group 3 relating to machine tools and numerical control systems and machine tools for generating optical quality surfaces,
b a robot specified in the entry in Group 3D relating thereto;
c a digitally-controlled spin-forming or flow-forming machine specified in the entry in Group 3A relating thereto;
d digitally-controlled equipment specified in the entries in Group 3A relating to equipment, tools, dies, moulds, fixtures and gauges for the manufacture or inspection of aircraft, aircraft manufactures, aircraft engines, gas turbine blades or vanes and gear making machines;
e a digitally-controlled electric arc device specified in the entry in Group 3C relating to plasma arc equipment;
f digitally-controlled equipment specified in the entries in Group 3D relating to equipment for the manufacture or testing of printed circuit boards, electronic components and materials;
g digitally-controlled equipment specified in the entry in Group 3D relating to equipment for the production of fibrous and filamentary materials;
h digitally-controlled equipment specified in the entry in Group 3F relating to electronic measuring, calibrating, counting and testing equipment;
i a digitally-controlled measuring system as specified in the entry in Group 3F relating to precision linear and angular measuring systems;
2 Capable of integrating in a hierarchical manner, while having access to data which may be stored outside the supervisory digital computer, the manufacturing process with (i) design functions or (ii) planning and scheduling functions; and
3 Automatically generating or verifying the manufacturing data and instructions, including selection of equipment and sequences of manufacturing operations for the manufacturing processes from design and manufacturing data, or automatically reconfiguring the automatically controlled industrial system through reselecting equipment and sequences of manufacturing operation by real-time processing of data pertaining to anticipated but unscheduled events (except software which only provides rescheduling of functionally identical equipment within flexible manufacturing units using prestored part programmes and a prestored strategy for the distribution of the part programmes).
In this entry–
“automatically controlled industrial system” is a combination of one or more flexible manufacturing units and a supervisory digital computer for coordination of the independent sequences of computer instructions to, from and within the flexible manufacturing units;
“flexible manufacturing unit” is an entity which consists of a combination of a digital computer including its own main storage and its own related equipment and at least one of the machines specified in head (1) above of this entry.
(See also the entry in Group 4 relating to technology for the design of automatically controlled industrial systems.)

GROUP 3E — Aircraft, Spacecraft, Compasses, Gyroscopic Apparatus, Marine Equipment and Ships (other than Warships and Naval Equipment)

IL1416 Ships, surface-effect vehicles, water-screw propellers, and specially designed components, the following–
1 Hydrofoil vessels with automatically controlled foil systems and capable of a speed of more than 40 knots in rough water (sea state five) S,I
2 Surface-effect vehicles, namely hovercraft, air cushion vehicles of both the sidewall and skirted varieties and all variations of vehicles using the wing-in-ground effect for positive lift A
3 Small waterplane area twin hull (SWATH) vessels having underwater hulls whose cross-sectional area varies along the longitudinal axis between points two major diameters from the bow and two major diameters from the stern A
4 Ships, sea going, including sea going fishing vessels and coasters, designed for speeds of over 26 knots when fully loaded S,I
5 Ships with hulls and propulsion machinery made wholly or primarily of non-magnetic materials S,I
6 Ships with decks and platforms specially strengthed to receive weapons S,I,L
7 Ships fitted with any of the following–
a apparatus and equipment specified in Group 1 S,I
b apparatus and equipment specified in the entries in Group 3 relating to–
i marine or terrestrial acoustic or ultrasonic systems for detecting or locating underwater or subterranean objects or features; S,I
ii communication, detection and tracking equipment; S,I
iii navigation, direction finding, radar equipment; or S,I
iv compasses and gyroscopic apparatus; or
c degaussing equipment S,I
8 Ships having special structural features for landing personnel and/or vehicles on a beach I
9 Ships capable of supporting helicopter operations and maintenance I
10 Ships capable of submerging I
11 Ships not elsewhere specified in this Part of this Schedule of below 100 tons GRT including inflatable craft in an inflated or uninflated state, except lightvessels, fire floats and dredgers I
12 Specially designed components for ships and surface effect vehicles specified in heads (1) to (11) above (inclusive), the following–
a advanced hull forms incorporating any of the following–
i stepped hulls for hydrofoil vessels; A
ii hulls for air cushion vehicles with trapezoidal platforms; A
iii hulls for surface-effect vehicles with catamaran-like walls; or A
iv hulls for wing-in-ground effect vehicles A
b fully submerged subcavitating or super-cavitating hydrofoils A
c lightweight structural components for hydrofoil vessels, SWATH vessels and surface-effect vehicles, constructed using anisotropic, orthotropic or sandwich construction methods A
d flexible skirts, seals and fingers for surface-effect vehicles A
e systems for automatically controlling the stability of hydrofoil vessels, SWATH vessels or surface-effect vehicles A
f power transmission shaft systems incorporating composite material components, for hydrofoil vessels and surface-effect vehicles A
g lightweight, high capacity (K factor greater than 150) gearing (planetary, cross-connect and multiple input/output gears and bearings) for hydrofoil vessels and surface-effect vehicles A
h water-cooled electrical propulsion machinery (motor and generator), including sectored-disc and concentric-drum motors for DC homopolar machines, for hydrofoil vessels and surface-effect vehicles A
i superconducting electrical propulsion machinery for hydrofoil vessels, SWATH vessels and surface-effect vehicles A
j lift fans for surface-effect vehicles, rated at more than 400 hp A
k water-jet propulsor systems rated at 3,000 input hp or more for hydrofoil vessels and surface-effect vehicles A
l moisture and particulate separator systems capable of removing 99.9% of particles larger than two micrometres in diameter with a maxium pressure loss of 1.6 kPa (16 millibar), for gas turbine engine air inlets for hydrofoil vessels, SWATH vessels and surface-effect vehicles A
m underwater hulls and struts for SWATH vessels A
13 Water-screw propellers, the following–
a supercavitating propellers rated at more than 10,000 hp A
b contrarotating propellers rated at more than 20,000 hp A
c controllable-pitch propellers rated at more than 20,000 hp A
d ventilated, base-ventilated and super-ventilated propellers A
IL1417 Submersible systems, including those incorporated in a submersible vehicle, the following–
1 Automatically controlled atmosphere-regeneration systems specially designed or modified for submersible vehicles which, in a single chemical reaction cycle, ensure carbon dioxide removal and oxygen renewal A
2 Systems specially designed or modified for the automated control of the motion of a submersible vehicle using navigation data and having closed-loop servo-control(s) having any of the following characteristics–
a capable of moving the vehicle to within ten metres of a predetermined point in the water column; A
b capable of maintaining the position of the vehicle within ten metres of a predetermined point in the water column; or A
c capable of maintaining the position of the vehicle within ten metres while following a cable on or under the sea bed A
3 Underwater vision systems, the following–
a television systems (consisting of camera, lights, monitor and signal transmission equipment) specially designed or modified for remote operation with a submersible vehicle, with a limiting resolution, when measured in air, greater than 500 lines using IEEE standard 208/1960 or any equivalent standard A
In this sub-head “limiting resolution” is a measure of resolution expressed in terms of the maximum number of lines per picture height discriminated on a test chart.
b systems specially designed or modified for remote operation with a submersible vehicle employing techniques to minimize the effects of backscatter, such as range-gated illuminators A
4 Remotely controlled articulated manipulators specially designed or modified for use with submersible vehicles and having any of the following characteristics–
a systems which control the manipulator using information from sensors which measure force or torque applied to an external object, distance from an external object, or tactile sense between the manipulator and an external object A
b controlled by proportional master-slave techniques or by using a dedicated stored-programme computer; or A
c capable of exerting a force of 250 Newtons or more or a torque of 250 Newton-metres or more and using titanium based alloys or fibrous and filamentary composite materials in their structural members A
(Note also the entry in Group 3D relating to robots.)
5 Photographic cameras and associated equipment specially designed or modified for use under water, having a film format of 35 mm or larger and any of the following characteristics–
a film advancement of more than 5 frames per second A
b annotation of the film with data provided by a source external to the camera A
c taking more than 250 full frame exposures without changing the film A
d autofocusing specially designed or modified for use under water A
e for operation at depths greater than 1,000 metres A
6 Light systems specially designed or modified for use under water, the following–
a Stroboscopic lights
i with a light output of more than 150 joules per flash; or A
ii flash rates of more than 5 flashes per second at a light output energy of 10 joules per flash A
b Lights and associated equipment capable of operation at depths exceeding 1,000 metres A
IL1418 Deep submergence vehicles, specially designed or modified associated systems, equipment, components and materials therefor, the following–
1 Deep submergence vehicles, whether or not for operation manned or unmanned, tethered or untethered, capable of operating at depths exceeding 1,000 metres A
2 Specially designed or modified associated systems, equipment, components and materials for the vehicles specified in head (1), including but not limited to pressure housings or pressure hulls propulsion motors and thrusters and hull penetrators or connectors A
IL1425 Floating docks and software therefor, the following–
1 Floating docks specially designed for use at remote locations, without support from shore bases A
2 Floating docks specially equipped to permit the operation, maintenance or repair of nuclear reactors A
3 Floating docks having both of the following characteristics A
a a lifting capacity of more than 40,000 short tons (36,364 tonnes); and
b larger than 120 metres in length and 30 metres in width, measured between the pontoons.
4 Specially designed software for computer-controlled pumping and flooding systems for the floating docks specified in heads (1) to (3) above (inclusive) to permit the docking of listing vessels A
(For technology relating to this entry, see the entry in Group 4 relating thereto.)
IL1431 Marine gas turbine engines for marine propulsion or shipboard power generation, whether originally designed as such or adapted for such use, and specially designed components therefor A
IL1460 Aircraft and helicopters, aircraft engines and aircraft and helicopter equipment, the following–
1 Aircraft and helicopters, having a maximum all up weight of 680 Kg or more, incorporating or equipped with equipment specified in Group 1, other than in the entry in that group relating to military aircraft and helicopters, or in the entries in Group 3 relating to navigation, direction finding, radar and airborne communication equipment, or to compasses, gyroscopes, accelerometers and inertial equipment A
2 Specially designed components for aircraft and helicopters specified in head (1) above A
3 Aircraft and helicopters having a maximum all up weight of 680 Kg or more L,ZL
4 Helicopter power transfer systems A
except those for use in civil helicopters only, the following–
a those which have been in civil use in bona fide civil helicopters for more than 8 years; and
b those for replacement in or servicing of specific, previously exported helicopters.
5 Gas turbine engines and auxiliary power units (APUs) for use in aircraft or helicopters A
except those for use in civil aircraft or helicopters only, the following–
a jet, turboprop and turboshaft aircraft engines in civil use in bona fide civil aircraft or civil helicopters for more than 8 years; and
b gas turbine powered aircraft APUs in civil use in bona fide civil aircraft or civil helicopters for more than 8 years.
6 Specially designed components for gas turbine engines, APUs and helicopter power transfer systems specified in heads (4) and (5) above, the following–
a hot-section components A
b engine control system components A
c gas turbine engine or APU rotor system components (including bearings). A
(For technology relating to this entry, see the entry in Group 4 relating thereto.)
IL1465 Spacecraft and launch vehicles, the following–
1 Spacecraft, manned or unmanned, (not including their payloads unless these fall within a description set out elsewhere in this Schedule), except scientific space probes which do not contain equipment specified either in head (3) below or elsewhere in this Schedule A
2 Launch vehicles for spacecraft specified in head (1) above A
3 Propulsion systems, guidance equipment, attitude control equipment; and on-board communication equipment for remote control of the equipment specified in heads (1) and (2) above A
4 Specially designed components for any of the foregoing A
IL1485 Compasses, gyroscopes (gyros), accelerometers and inertial equipment, the following–
1 Accelerometers with a threshold of 0.005 g or less, or a linearity error within 0.25% of full scale output, or both, which are designed for use in inertial navigation systems or in guidance systems, of all types A
2 Automatic pilots used for purposes other than aircraft control and specially designed integration software therefor, except marine types for surface vessels A
3 Gyro compasses with provision for determining and transmitting ship’s level reference data (roll, pitch) in addition to own ship’s course data A
4 Gyro-astro compasses and other devices which derive position or orientation by means of automatically tracking celestial bodies A
5 Gyro-stabilisers used for purposes other than aircraft control, except those for stabilising an entire surface vessel A
6 Gyros with a rated free directional drift rate of less than 0.5° (1 Sigma or root mean square) per hour in a 1 g environment A
7 Continuous output accelerometers which use servo or force balance techniques and gyros, both specified to function at acceleration levels greater than 100 g A
8 Inertial or other equipment using accelerometers specified in heads (1) or (7) above or gyros specified in heads (6) or (7) above, and systems incorporating such equipment and specially designed integration software therefor A
9 Integrated flight instrument systems which include gyro-stabilisers or automatic pilots for aircraft and specially designed integration software therefor A
except those systems integrated solely for VOR/ILS navigation and approaches.
10 Specially designed testing, calibration and alignment equipment for the equipment specified in heads (1) to (9) above (inclusive) A
11 Specially designed components and software for the equipment specified in heads (1) to (10) above (inclusive) A

GROUP 3F

Note. Goods specified in the heads of this Group may also be specified in Group 1 of this part of this Schedule.

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