Legalize / United Kingdom / Statutory-Instrument

The Export of Goods (Control) Order 1994

Type Statutory-Instrument

Publication 1994-04-24

State In force

Department King's Printer of Acts of Parliament

Source legislation.gov.uk

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(f) Rotary input type shaft absolute position encoders having either of the following:

(1) A resolution of better than 1 part in 265,000 (18 bit resolution) of full scale; or

(2) An accuracy better than ± 2.5 seconds of arc.

(3A002) General purpose electronic equipment:

(a) Recording equipment, as follows, and specially designed test tape therefor:

(1) Analogue instrumentation magnetic tape recorders, including those permitting the recording of digital signals (e.g., using a high density digital recording (HDDR) module), having any of the following:

(a) A bandwidth exceeding 4 MHz per electronic channel or track;

(b) A bandwidth exceeding 2 MHz per electronic channel or track and having more than 42 tracks; or

(c) A time displacement (base) error, measured in accordance with applicable Inter Range Instrumentation Group (IRIG) or Electronic Industries Association (EIA) documents, of less than ± 0.1 microsecond;

(2) Digital video magnetic tape recorders having a maximum digital interface transfer rate exceeding 180 Mbit/s, except: those specially designed for television recording using a signal format standardized or recommended by the International Radio Consultative Committee (CCIR) or the International Technical Commission (IEC) for civil television applications;

(3) Digital instrumentation magnetic tape data recorders employing helical scan techniques or fixed head techniques, having either of the following:

(a) A maximum digital interface transfer rate exceeding 175 Mbit/s; or

(b) Space qualified;

Note: Sub-head a.3. of this entry does not specify analogue magnetic tape recorders equipped with HDDR conversion electronics and configured to record only digital data.

(4) Equipment, with a maximum digital interface transfer rate exceeding 175 Mbit/s, designed to convert digital video magnetic tape recorders for use as digital instrumentation data recorders;

(5) Waveform digitisers and transient recorders with both of the following[^f00042]:

(a) Digitising rates equal to or more than 200 million samples per second and a resolution of 10 bits or more; and

(b) A continuous throughput of 2 Gbits/s or more;

Note: For those instruments with a parallel bus architecture, the continuous throughput rate is the highest word rate multiplied by the number of bits in a word. In this entry, “continuous throughput” means the fastest data rate the instrument can output to mass storage without the loss of any information whilst sustaining the sample rate and analogue-to-digital conversion.

(b) Frequency synthesiser electronic assemblies having a frequency switching time from one selected frequency to another of less than 1 ms;

(1) Capable of analysing frequencies exceeding 31 GHz;

(2) Dynamic signal analysers with a real-time bandwidth exceeding 25.6 kHz; except:

Those using only constant percentage bandwidth filters (also known as octave or fractional octave filters);

(d) Frequency synthesised signal generators producing output frequencies, the accuracy and short term and long term stability of which are controlled, derived from or disciplined by the internal master frequency, and having any of the following:

(1) A maximum synthesised frequency exceeding 31 GHz;

(2) A frequency switching time from one selected frequency to another of less than 1 ms; or

(3) A single sideband (SSB) phase noise better than -(126 + 20 log₁₀F − 20 log₁₀f) in dBc/Hz, where F is the off-set from the operating frequency in Hz and f is the operating frequency in MHz;

Note: Head d. of this entry does not specify equipment in which the output frequency is either produced by the addition or subtraction of two or more crystal oscillator frequencies, or by an addition or subtraction followed by a multiplication of the result.

(e) Network analysers with a maximum operating frequency exceeding 31 GHz;

Note: Head e. of this entry does not specify swept frequency network analysers with a maximum operating frequency not exceeding 40 GHz and which do not contain a data bus for remote control interfacing.

(f) Microwave test receivers with both of the following:

(1) A maximum operating frequency exceeding 31 GHz; and

(2) Capable of measuring amplitude and phase simultaneously;

(g) Atomic frequency standards having either of the following characteristics:

(1) Long term stability (aging) less (better) than 1 × 10−11/month; or

Note: Sub-head g.1. of this entry does not specify non-space qualified rubidium standards.

(2) Space qualified;

(h) Emulators for microcircuits specified in sub-heads a.3. or a.9. of entry 3A001.

Note: Head h. of this entry does not specify emulators designed for a family which contains at least one device not specified in sub-heads a.3. or a.9. of entry 3A001.

(3A101) Electronic devices and components, other than those specified in entry 3A001, as follows:

(a) Analogue-to-digital converters, usable in missiles, designed to meet military specifications for ruggedized equipment;

(b) Accelerators capable of delivering electromagnetic radiation produced by bremsstrahlung from accelerated electrons of 2 MeV or greater, and systems containing those accelerators.

Note: Head b of this entry does not specify goods specially designed for medical purposes.

(3A201) Electronic devices and components, other than those specified in entry 3A001, as follows:

(a) Capacitors with the following characteristics:

(1) Voltage rating greater than 1.4 kV, energy storage greater than 10J, capacitance greater than 500 nF and series inductance less than 50 nH; or

(2) Voltage rating greater than 750 V, capacitance greater than 250 nF and series inductance less than 10 nH;

(b) Superconducting solenoidal electromagnets with all of the following characteristics:

(1) Capable of creating magnetic fields of more than 2 Teslas (20 kilogauss);

(2) With an L/D ratio (length divided by inner diameter) greater than 2;

(3) With an inner diameter of more than 300 mm; and

(4) With a magnetic field uniform to better than 1% over the central 50% of the inner volume.

Note: Head b. of this entry does not specify magnets specially designed for and exported as parts of medical nuclear magnetic resonance (NMR) imaging systems. In this entry, “as part of” does not necessarily mean physical part in the same shipment; separate shipments from different sources are allowed, provided the related export documents clearly specify that the shipments are dispatched “as part of” the same imaging systems.

except:

Accelerators that are component parts of devices designed for purposes other than electron beam or X-ray radiation (electron microscopy, for example) and those designed for medical purposes: Having an accelerator peak electron energy of 500 keV or greater but less than 25 MeV and with a figure of merit (K) of 0.25 or greater, where K is defined as: K = 1.7 × 10³V2.65Q; where V is the peak electron energy in million electron volts and Q is the total accelerated charge in coulombs if the accelerator beam pulse duration is less than or equal to 1 microsecond; if the accelerator beam pulse duration is greater than 1 microsecond, Q is the maximum accelerated charge in 1 microsecond [Q equals the integral of i with respect to t, over the lesser of 1 microsecond or the time duration of the beam pulse (Q = [integral] idt), where i is beam current in amperes and t is time in seconds]; or Having an accelerator peak electron energy of 25 MeV or greater and a peak power greater than 50 MW. [Peak power = (peak potential in volts) × (peak beam current in amperes)]. Notes: Time duration of the beam pulse—In machines, based on microwave accelerating cavities, the time duration of the beam pulse is the lesser of 1 microsecond or the duration of the bunched beam packet resulting from one microwave modulator pulse. Peak beam current—In machines based on microwave accelerating cavities, the peak beam current is the average current in the time duration of a bunched beam packet.

(3A202) Oscilloscopes and transient recorders other than those specified in sub-head a.5. of entry 3A002, as follows; and specially designed components therefor:

(a) Non-modular analogue oscilloscopes having a bandwidth of 1 GHz or greater;

(b) Modular analogue oscilloscope systems having either of the following characteristics:

(1) A mainframe with a bandwidth of 1 GHz or greater; or

(2) Plug-in modules with an individual bandwidth of 4 GHz or greater;

(c) Analogue sampling oscilloscopes for the analysis of recurring phenomena with an effective bandwidth greater than 4 GHz;

(d) Digital oscilloscopes and transient recorders, using analogue-to-digital conversion techniques, capable of storing transients by sequentially sampling single-shot inputs at successive intervals of less than 1 ns (greater than 1 giga-sample per second), digitizing to 8 bits or greater resolution and storing 256 or more samples.

Notes:

(1) Specially designed components specified in this entry are the following, for analogue oscilloscopes:

(a) Plug-in units;

(b) External amplifiers;

(d) Sampling devices;

(e) Cathode ray tubes.

(2) In this entry, the term “bandwidth” means the band of frequencies over which the deflection on the cathode ray tube does not fall below 70.7% of that at the maximum point measured with a constant input voltage to the oscilloscope amplifier.

(3A225) Frequency changers (also known as converters or inverters) or generators, other than those specified in entry B10b.2.k. of Group 2 of Part III of this Schedule, having all of the following characteristics:

(a) A multiphase output capable of providing a power of 40 W or more;

(b) Capable of operating in the frequency range between 600 and 2000 Hz;

(d) Frequency control better than 0.1%.

(3A226) Direct current high-power supplies capable of continuously producing, over a time period of 8 hours, 100 V or greater with current output of 500 A or greater and with current or voltage regulation better than 0.1%.

(3A227) High-voltage direct current power supplies capable of continuously producing, over a time period of 8 hours, 20,000 V or greater with current output of 1 A or greater and with current or voltage regulation better than 0.1%.

(3A228) Switching devices, as follows:

(a) Cold-cathode tubes (including gas krytron tubes and vacuum sprytron tubes), whether gas filled or not, operating similarly to a spark gap, containing three or more electrodes, and having all of the following characteristics:

(1) Anode peak voltage rating of 2,500 V or more;

(2) Anode peak current rating of 100 A or more; and

(3) Anode delay time of 10 microsecond or less;

(b) Triggered spark-gaps having an anode delay time of 15 microsecond or less and rated for a peak current of 500 A or more;

(1) Anode peak voltage rating greater than 2,000 V;

(2) Anode peak current rating of 500 A or more; and

(3) Turn-on time of 1 microsecond or less.

(3A229) Firing sets and equivalent high-current pulse generators (for controlled detonators), as follows[^f00043]:

(a) Explosive detonator firing sets designed to drive multiple controlled detonators specified in entry 3A232;

(b) Modular electrical pulse generators (pulsers) designed for portable, mobile or ruggedized use (including xenon flash-lamp drivers) having all the following characteristics:

(1) Capable of delivering their energy in less than 15 microsecond;

(2) Having an output greater than 100 A;

(3) Having a rise time of less than 10 microsecond into loads of less than 40 ohms (rise time is the time interval from 10% to 90% current amplitude when driving a resistive load);

(4) Enclosed in a dust-tight enclosure;

(5) No dimension greater than 254 mm;

(6) Weight less than 25 kg; and

(7) Specified for use over an extended temperature range (223 K [-50°C] to 373 K [100°C]) or specified as suitable for aerospace use.

(3A230) High-speed pulse generators with output voltages greater than 6 volts into a less than 55 ohm resistive load, and with pulse transition times less than 500 picoseconds.

In this entry, “pulse transition time” means the time interval between 10% and 90% voltage amplitude.

(3A231) Neutron generator systems, including tubes, designed for operation without an external vacuum system and utilizing electrostatic acceleration to induce a tritium-deu-terium nuclear reaction.

(3A232) Detonators and multipoint initiation systems, as follows[^f00044]:

(a) Electrically driven explosive detonators, the following:

(1) Exploding bridge (EB);

(2) Exploding bridge wire (EBW);

(3) Slapper;

(4) Exploding foil initiators (EFI);

(b) Arrangements using single or multiple detonators designed to nearly simultaneously initiate an explosive surface (over greater than 5000 mm²) from a single firing signal (with an initiation timing spread over the surface of less than 2.5 microseconds).

Notes:

(1) This entry does not specify detonators using only primary explosives, such as lead azide.

(2) The detonators in this entry all utilise a small electrical conductor (bridge, bridge wire or foil) that explosively vaporizes when a fast, high-current electrical pulse is passed through it. In nonslapper types, the exploding conductor starts a chemical detonation in a contacting high-explosive material such as PETN (Pentaerythritoltetranitrate). In slapper detonators, the explosive vaporization of the electrical conductor drives a flyer or slapper across a gap and the impact of the slapper on an explosive starts a chemical detonation. The slapper in some designs is driven by a magnetic force. The term 'exploding foil' detonator may refer to either an EB or a slapper-type detonator.

(3A233) Mass spectrometers, other than those specified in entry B20g. of Group 2 of Part III of this Schedule, capable of measuring ions of 230 atomic mass units or greater and having a resolution of better than 2 parts in 230, as follows; and ion sources therefor:

(a) Inductively coupled plasma mass spectrometers (ICP/MS);

(b) Glow discharge mass spectrometers (GDMS);

(d) Electron bombardment mass spectrometers which have a source chamber constructed from, lined with or plated with materials resistant to UF₆;

(e) Molecular beam mass spectrometers as follows:

(1) Which have a source chamber constructed from, lined with or plated with stainless steel or molybdenum and have a cold trap capable of cooling to 193 K (-80°C) or less; or

(2) Which have a source chamber constructed from, lined with or plated with materials resistant to UF₆; or

(f) Mass spectrometers equipped with a microfluorination ion source designed for use with actinides or actinide fluorides.

(3A990) Apparatus or devices, other than those specified in entry PL5006 of Group 1 of Part III of this Schedule or entries 3A229 to 3A232 of this Group, designed for the handling, control, discharging, decoying, jamming, detonation, disruption or detection of explosive devices or improvised explosive devices;

except: Inspection devices not employing electronic management; X-ray apparatus or devices, not specified elsewhere in this Group.

3B

Test, Inspection and Production Equipment

(3B) Equipment for the manufacture or testing of semiconductor devices or materials, as follows, and specially designed components and accessories therefor:

(3B001) Stored programme controlled equipment for epitaxial growth, as follows:

(a) Capable of producing a layer thickness uniform to less than ± 2.5% across a distance of 75 mm or more;

(b) Metal organic chemical vapour deposition (MOCVD) reactors specially designed for compound semiconductor crystal growth by the chemical reaction between materials specified in entries 3C003 or 3C004;

(3B002) Stored programme controlled equipment designed for ion implantation, having any of the following:

(a) An accelerating voltage exceeding 200 keV;

(b) Specially designed and optimized to operate at an accelerating voltage of less than 10 keV;

(d) Capable of high energy oxygen implant into a heated semiconductor material substrate.

(3B003) Stored programme controlled anisotropic plasma dry etching equipment, as follows:

(a) With cassette-to-cassette operation and load-locks, and having either of the following:

(1) Magnetic confinement; or

(2) Electron cyclotron resonance (ECR);

(b) Specially designed for equipment specified in entry 3B005 and having either of the following:

(1) Magnetic confinement; or

(2) Electron cyclotron resonance (ECR).

(3B004) Stored programme controlled plasma enhanced CVD equipment, as follows:

(a) With cassette-to-cassette operation and load-locks, and having either of the following:

(1) Magnetic confinement; or

(2) Electron cyclotron resonance (ECR);

(b) Specially designed for equipment specified in entry 3B005 and having either of the following:

(1) Magnetic confinement; or

(2) Electron cyclotron resonance (ECR).

(3B005) Stored programme controlled automatic loading multi-chamber central wafer handling systems, having interfaces for wafer input and output, to which more than two pieces of semiconductor processing equipment are to be connected, to form an integrated system in a vacuum environment for sequential multiple wafer processing.

Note: This entry does not specify automatic robotic wafer handling systems not designed to operate in a vacuum environment.

(3B006) Stored programme controlled lithography equipment, as follows:

(a) Align and expose step and repeat equipment for wafer processing using photo-optical or X-ray methods, having either of the following:

(1) A light source wavelength shorter than 400 nm; or

(2) Capable of producing a pattern with a minimum resolvable feature size of 0.7 micrometre or less when calculated by the following formula:

$$MRF=(wavelength in micrometre)×(K factor)numerical aperture$ where: “MRF” means the minimum resolvable feature size; the “K factor” = 0.7; and “wavelength” means the exposure light source wavelength;$

(b) Equipment specially designed for mask making or semiconductor device processing using deflected focussed electron beam, ion beam or laser beam, with any of the following:

(1) A spot size smaller than 0.2 micrometre;

(2) Capable of producing a pattern with a feature size of less than 1 micrometre; or

(3) An overlay accuracy of better than ± 0.20 micrometre (3 sigma).

(3B007) Masks or reticles, as follows:

(a) For integrated circuits specified in entry 3A001;

(b) Multi-layer masks with a phase shift layer.

(3B008) Stored programme controlled test equipment, specially designed for testing semiconductor devices and unencapsulated dice, as follows:

(a) For testing S-parameters of transistor devices at frequencies exceeding 31 GHz;

(b) For testing integrated circuits, and capable of performing functional (truth table) testing at a pattern rate of more than 40 MHz;

Note: Head b. of this entry does not specify test equipment specially designed for testing:

(1) Electronic assemblies or a class of electronic assemblies for home or entertainment applications;

(2) Electronic components, electronic assemblies or integrated circuits not specified in this Group.

Note: Head c. of this entry does not specify test equipment specially designed for testing microwave integrated circuits for equipment designed or rated to operate in the Standard Civil Telecommunication Bands at frequencies not exceeding 31 GHz.

(d) Electron beam systems designed for operation at or below 3 keV, or laser beam systems, for the non-contactive probing of powered-up semiconductor devices, with both of the following:

(1) Stroboscopic capability with either beam-blanking or detector strobing; and

(2) An electron spectrometer for voltage measurement with a resolution of less than 0.5 V.

Note: Head d. of this entry does not specify scanning electron microscopes; except: when specially designed and instrumented for the non-contactive probing of powered-up semiconductor devices.

3C

Materials

(3C001) Hetero-epitaxial materials consisting of a substrate with stacked epitaxially grown multiple layers of:

(a) Silicon;

(b) Germanium; or

Note: III/V compounds are polycrystalline or binary or complex monocrystalline products consisting of elements of groups IIIA and VA of Mendeleyev’s periodic classification table (gallium arsenide, gallium-aluminium arsenide, indium phosphide, etc.).

(3C002) Resist materials, as follows, and substrates coated with controlled resists:

(a) Positive resists for semiconductor lithography specially adjusted (optimised) for use at wavelengths below 370 nm;

(b) All resists, for use with electron beams or ion beams, with a sensitivity of 0.01 microcoulomb/mm² or better;

(d) All resists optimized for surface imaging technologies, including silylated resists.

Note: Silylation techniques are defined as processes incorporating oxidation of the resist surface to enhance performance for both wet and dry developing.

(3C003) Organo-inorganic compounds as follows:

(a) Organo-metallic compounds of aluminium, gallium or indium, having a purity (metal basis) better than 99.999%;

(b) Organo-arsenic, organo-antimony and organo-phosphorus compounds having a purity (inorganic element basis) better than 99.999%.

Note: This entry only specifies compounds whose metallic, partly metallic or non-metallic element is directly linked to carbon in the organic part of the molecule.

(3C004) Hydrides of phosphorus, arsenic or antimony, having a purity better than 99.999%, even diluted in inert gases or hydrogen.

Note: This entry does not specify hydrides containing 20% molar or more of inert gases or hydrogen.

3D

Software

(3D001) Software specially designed for the development or production of goods specified in head b. of entry 3A001 to head h. of entry 3A002 or Sub-category 3B.

(3D002) Software specially designed for the use of stored programme controlled equipment specified in sub-category 3B.

(3D003) Computer-aided-design (CAD) software for semiconductor devices or integrated circuits, having any of the following:

(a) Design rules or circuit verification rules;

(b) Simulation of the physically laid out circuits; or

Note: A lithographic processing simulator is a software package used in the design phase to define the sequence of lithographic, etching and deposition steps for translating masking patterns into specific topographical patterns in conductors, dielectrics or semiconductor material.

Note: This entry does not specify software specially designed for schematic entry, logic simulation, placing and routing, layout verification or pattern generation tape. N.B.: Libraries, design attributes or associated data for the design of semiconductor devices or integrated circuits are considered as technology.

(3D101) Software specially designed for the use of goods specified in head b. of entry 3A101.

3E

Technology

(3E001) Technology required for the development or production of goods specified in sub-categories 3A, 3B or 3C;

Note: This entry does not specify technology for the development or production of:

(a) Microwave transistors operating at frequencies below 31 GHz;

(b) Integrated circuits specified in sub-heads a.3. to a.12. of entry 3A001, having both of the following characteristics:

(1) Using technology of one micrometre or more; and

(2) Not incorporating multi-layer structures.

N.B.: This Note does not preclude the export of multilayer technology for devices incorporating a maximum of two metal layers and two polysilicon layers.

(3E002) Other technology for the development or production of:

(a) Vacuum microelectronic devices;

(b) Hetero-structure semiconductor devices such as high electron mobility transistors (HEMT), hetero-bipolar transistors (HBT), quantum well or super lattice devices;

(d) Substrates of films of diamond for electronic components.

(3E101) Technology required for the use of goods specified in sub-heads a.1. or a.2. of entry 3A001, entries 3A101 or 3D101.

(3E102) Technology required for the development of software specified in entry 3D101.

(3E201) Technology required for the use of goods specified in sub-head e.2. of entry 3A001, sub-head e.3. of entry 3A001, sub-head e.5. of entry 3A001, or entries 3A201, 3A202, 3A225 to 3A233.

(3E990) Technology required for the use of goods specified in entry 3A990.

Category 4—Computers

Notes:

(1) In order to determine the export control requirements on computers, related equipment or software performing telecommunications or local area network functions they must also be evaluated against Category 5 (Part 1 – Telecommunications).

N.B.:

(1) Control units which directly interconnect the buses or channels of central processing units, main storage or disk controllers are not regarded as telecommunications equipment described in Category 5 (Part 1 – Telecommunications).

(2) Software which provides routing or switching of datagram or fast select packets (i.e., packet by packet route selection) or of software specially designed for packet switching, is specified in Category 5 (Part 1 – Telecommunications).

(2) Computers, related equipment or software performing cryptographic, cryptanalytic, certifiable multilevel security or certifiable user isolation functions, or which limit electromagnetic compatibility (EMC), must also be evaluated against the performance characteristics in Category 5 (Part 2—Information Security).

4A

Equipment, Assemblies and Components

(4A001) Electronic computers and related equipment, as follows, and electronic assemblies and specially designed components therefor[^f00045]:

(a) Specially designed to have either of the following characteristics:

(1) Rated for operation at an ambient temperature below 228 K (-45°C) or above 358 K (85°C); or

Note: Sub-head a.1 of this entry does not apply to computers specially designed for civil automobile or railway train applications.

(2) Radiation hardened to exceed any of the following specifications:

(a) Total Dose 5 × 10⁵ Rads (Si);

(b) Dose Rate Upset 5 × 10⁸ Rads (Si)/sec; or

Note: For equipment designed or rated for transient ionising radiation, see Group 1 of Part III of this Schedule.

(b) Having characteristics or performing functions exceeding the limits in Category 5 (Part 2—Information Security).

(4A002) Hybrid computers, as follows, and electronic assemblies and specially designed components therefor[^f00046]:

(a) Containing digital computers specified in entry 4A003;

(b) Containing analogue-to-digital converters having both of the following characteristics:

(1) 32 channels or more; and

(2) A resolution of 14 bits (plus sign bit) or more with a conversion rate of 200,000 conversions/s or more.

(4A003) Digital computers, electronic assemblies, and related equipment therefor, as follows, and specially designed components therefor:

Notes: This entry includes vector processors, array processors, digital signal processors, logic processors, and equipment for image enhancement or signal processing. The control on export of digital computers or related equipment described in or of a type described in this entry is determined by the export control requirements applying to the other equipment or systems, provided: The digital computers or related equipment are essential for the operation of the other equipment or systems; The digital computers or related equipment are not a principal element of the other equipment or systems. N.B.: Digital computers or related equipment for telecommunications equipment, are specified in Category 5 (Part 1 – Telecommunications). Note: The technology for the digital computers and related equipment is evaluated against sub-category 4E.

(a) Designed or modified for fault tolerance;

Note: For the purposes of head a. of this entry, digital computers and related equipment are not considered to be designed or modified for fault tolerance if they use: Error detection or correction algorithms in main storage; The interconnection of two digital computers so that, if the active central processing unit fails, an idling but mirroring central processing unit can continue the system’s functioning; The interconnection of two central processing units by data channels or by use of shared storage to permit one central processing unit to perform other work until the second central processing unit fails, at which time the first central processing unit takes over in order to continue the system’s functioning; or The synchronisation of two central processing units by software so that one central processing unit recognises when the other central processing unit fails and recovers tasks from the failing unit.

(b) Digital computers having a composite theoretical performance (CTP) exceeding 260 million theoretical operations per second (Mtops);

(c) Electronic assemblies specially designed or modified to be capable of enhancing performance by aggregation of computing elements so that the composite theoretical performance (CTP) of the aggregation exceeds the limit in head b. of this entry;

Notes: Head c. of this entry applies only to electronic assemblies and programmable interconnections not exceeding the limit of head b. of this entry, when shipped as unintegrated electronic assemblies. It does not apply to electronic assemblies inherently limited by nature of their design for use as related equipment specified in heads d. to f. of this entry. Head c. of this entry does not specify electronic assemblies specially designed for a product or family of products whose maximum configuration does not exceed the limit of head b. of this entry.

(d) Graphics accelerators or graphics coprocessors exceeding a 3-D vector rate of 1,600,000;

(e) Equipment performing analogue-to-digital conversions exceeding the limits in sub-head a.5. of entry 3A001;

(f) Equipment containing terminal interface equipment exceeding the limits in sub-head b.3. of entry 5A001;

Note: For the purposes of head f. of this entry, terminal interface equipment includes local area network interfaces, modems and other communications interfaces. Local area network interfaces are evaluated as network access controllers.

(g) Equipment specially designed to provide for the external interconnection of digital computers or associated equipment which allows communications at data rates exceeding 80 Mbytes/s.

Note: Head g. of this entry does not control internal interconnection equipment (e.g. backplanes and buses) or passive interconnection equipment.

(4A004) Computers, as follows, and specially designed related equipment, electronic assemblies and components therefor:

(a) Systolic array computers;

(b) Neural computers;

(4A101) Analogue computers, digital computers or digital differential analysers, other than those specified in sub-head a.1. of entry 4A001, which are ruggedized and designed or modified for use in systems specified in entries 9A004 or 9A104.

(4A102) Hybrid Computers specially designed for modelling, simulation or design integration of systems specified in entries 9A004 or 9A104.

Notes: This entry only applies when the equipment is supplied with software specified in entries 7D103 or 9D103. Software for the goods specified in this entry is determined by the export control requirements of either entry 7D103 or 9D103.

4B

Test, Inspection and Production Equipment

None

4C

Materials

None

4D

Software

Note: Software for the development, production, or use of equipment described in other Categories is dealt with in the appropriate Category. Software for equipment described in this Category is dealt with herein.

(4D001) Software specially designed or modified for the development, production or use of goods specified in entries 4A001 to 4A004, or sub-category 4D.

(4D002) Software specially designed or modified to support technology specified in subcategory 4E.

(4D003) Specific software, as follows:

(a) Operating system software, software development tools and compilers specially designed for multi-data-stream processing equipment, in source code;

(b) Expert systems or software for expert system inference engines providing both:

(1) Time dependent rules; and

(2) Primitives to handle the time characteristics of the rules and the facts;

(c) Software having characteristics or performing functions exceeding the limits in Category 5 (Part 2-Information Security);

(d) Operating systems specially designed for real time processing equipment which guarantees a global interrupt latency time of less than 20 microseconds.

4E

Technology

(4E001) Technology required for the development, production or use of goods specified in sub-categories 4A or 4D.

(4E002)

(a) Technology for the development or production of goods designed for multi-data-stream processing where the composite theoretical performance (CTP) exceeds 120 Mtops;

(b) Technology required for the development or production of magnetic hard disk drives with a maximum bit transfer rate exceeding 47 Mbit/s.

Category 5 —Telecommunications and Information Security

Part 1 — — Telecommunications

Notes:

(1) Components, lasers, test and production equipment, materials and software therefor, which are specially designed for telecommunications equipment or systems are described in this Category.

(2) Digital computers, related equipment or software, when essential for the operation and support of telecommunications equipment specified in or of a type described in this Category, are regarded as specially designed components, provided they are the standard models customarily supplied by the manufacturer. This includes operation, administration, maintenance, engineering or billing computer systems.

5A1

Equipment, Assemblies and Components

(5A001)

(a) Any type of telecommunications equipment having any of the following characteristics, functions or features:

(1) Specially designed to withstand transitory electronic effects or electromagnetic pulse arising from a nuclear explosion;

(2) Specially hardened to withstand gamma, neutron or ion radiation;

(3) Specially designed to operate outside the temperature range from 218 K (-55°C) to 397 K (124°C);

Note: Sub-head a.3 of this entry applies only to electronic equipment.

Note: Sub-heads a.2. and a.3. of this entry do not apply to equipment on board satellites.

(b) Telecommunication transmission equipment or systems, and specially designed components and accessories therefor, having any of the following characteristics, functions or features:

Note: Telecommunication transmission equipment: Categorised as follows, or combinations thereof: Radio equipment (e.g., transmitters, receivers and transceivers); Line terminating equipment; Intermediate amplifier equipment; Repeater equipment; Regenerator equipment; Translation encoders (transcoders); Multiplex equipment (statistical multiplex included); Modulators/demodulators (modems); Transmultiplex equipment (see CCITT Recommendation G.701); Stored programme controlled digital crossconnection equipment; Gateways and bridges; Media access units; and Designed for use in single or multi-channel communication via: Wire (line); Coaxial cable; Optical fibre cable; Electromagnetic radiation; Underwater acoustic wave propagation.

(1) Employing digital techniques, including digital processing of analogue signals, and designed to operate at a digital transfer rate at the highest multiplex level exceeding 45 Mbit/s or a total digital transfer rate exceeding 90 Mbit/s;

Note: Sub-head b.1. of this entry does not specify equipment specially designed to be integrated and operated in any satellite system for civil use.

(2) Being stored programme controlled digital cross connect equipment with a digital transfer rate exceeding 8.5 Mbit/s per port;

(3) Being equipment containing:

(a) Modems using the bandwidth of one voice channel with a data signalling rate exceeding 28,800 bit/s;

(b) Communication channel controllers with a digital output having a data signalling rate exceeding 2.1 Mbit/s per channel; or

(c) Network access controllers and their related common medium having a digital transfer rate exceeding 156 Mbit/s;

Note: Equipment, not elsewhere specified, containing a network access controller, cannot have any type of telecommunications interface;

except:

Those described in, but not specified in, sub-head b.3. of this entry.

(4) Employing a laser and having any of the following characteristics:

(a) A transmission wavelength exceeding 1,000 nm;

(b) Employing analogue techniques and having a bandwidth exceeding 45 MHz;

(c) Employing coherent optical transmission or coherent optical detection techniques (also called optical heterodyne or homodyne techniques);

(d) Employing wavelength division multiplexing techniques; or

(e) Performing optical amplification;

(5) Being radio equipment operating at input or output frequencies exceeding:

(a) 31 GHz for satellite-earth station applications;

(b) 26.5 GHz for other applications;

Note: Sub-head b.5.b. of this entry does not specify equipment for civil use conforming with an International Telecommmunications Union (ITU) allocated band between 26.5 and 31 GHz.

(6) Being radio equipment:

(a) Employing quadrature-amplitude-modulation (QAM) techniques above level 4 if the total digital transfer rate exceeds 8.5 Mbit/s;

(b) Employing quadrature-amplitude-modulation (QAM) techniques above level 16 if the total digital transfer rate is equal to or less than 8.5 Mbit/s; or

Note:

(1) Sub-head b.6. of this entry does not specify equipment specially designed to be integrated and operated in any satellite system for civil use.

(2) Sub-head b.6. of this entry does not specify radio relay equipment for operation in an International Telecommunications Union

(ITU) allocated band:

(1) Not exceeding 960 MHz; or

(2) With a total digital transfer rate not exceeding 8.5 Mbit/s; and

(b) Having a spectral efficiency not exceeding 4 bit/sec/Hz.

(7) Being radio equipment operating in the 1.5 to 87.5 MHz band and having either of the following characteristics:

(1) Automatically predicting and selecting frequencies and total digital transfer rates per channel to optimize the transmission; and

(2) Incorporating a linear power amplifier configuration having a capability to support multiple signals simultaneously at an output power of 1 kW or more in the 1.5 to 30 MHz frequency range or 250 W or more in the 30 to 87.5 MHz frequency range, over an instantaneous bandwidth of one octave or more and with an output harmonic and distortion content of better than -80 dB; or

(b) Incorporating adaptive techniques providing more than 15 dB suppression of an interfering signal;

(8) Being radio equipment employing spread spectrum or frequency agility (frequency hopping) techniques having either of the following characteristics:

(a) User programmable spreading codes; or

(b) A total transmitted bandwidth which is 100 or more times the bandwidth of any one information channel and in excess of 50 kHz;

(9) Being digitally controlled radio receivers having more than 1,000 channels, which:

(a) Search or scan automatically a part of the electromagnetic spectrum;

(b) Identify the received signals or the type of transmitter; and

(10) Providing functions of digital signal processing as follows:

(a) Voice coding at rates of less than 2,400 bit/s;

(b) Employing circuitry which incorporates user-accessible programmability of digital signal processing circuits exceeding the limits of head b. of entry 4A003;

(11) Being underwater communications systems having any of the following characteristics:

(a) An acoustic carrier frequency outside the range from 20 to 60 kHz;

(b) Using an electromagnetic carrier frequency below 30 kHz; or

(c) Stored programme controlled switching equipment and related signalling systems, having any of the following characteristics, functions or features, and specially designed components and accessories therefor;

Note: Statistical multiplexers with digital input and digital output which provide switching are treated as stored programme controlled switches.

(1) Common channel signalling;

Note: Signalling systems in which the signalling channel is carried in and refers to no more than 32 multiplexed channels forming a trunk line of no more than 2.1 Mbit/s, and in which the signalling information is carried in a fixed, time division multiplexed channel without the use of labelled messages, are not considered to be common channel signalling systems.

(2) Containing Integrated Services Digital Network (ISDN) functions and having either of the following:

(a) Switch-terminal (e.g., subscriber line) interfaces with a digital transfer rate at the highest multiplex level exceeding 192,000 bit/s, including the associated signalling channel (e.g., 2B+D); or

(b) The capability that a signalling message received by a switch on a given channel that is related to a communication on another channel may be passed through to another switch;

Note: Sub-head c.2. of this entry does not include:

(1) The evaluation and appropriate actions taken by the receiving switch;

(2) Unrelated user message traffic on a D channel of Integrated Services Digital Network (ISDN).

(3) Multi-level priority and pre-emption for circuit switching;

Note: Sub-head c.3. of this entry does not specify single-level call pre-emption.

(4) Dynamic adaptive routing;

(5) Routing or switching of datagram packets;

except:

When applied to networks using only network access controllers or to network access controllers themselves;

(6) Routing or switching of fast select packets;

except:

When applied to networks using only network access controllers or to network access controllers themselves;

(7) Designed for automatic hand-off of cellular radio calls to other cellular switches or for automatic connection to a centralized subscriber data base common to more than one switch;

(8) Being packet switches, circuit switches and routers with ports or lines exceeding either:

(a) A data signalling rate of 64,000 bit/s per channel for a communications channel controller; or

Note: Sub-head c.8.a. of this entry does not include the multiplexing over a composite link of communications channels not specified in sub-head c.8.a.

(b) A digital transfer rate of 33 Mbit/s for a network access controller and related common medium;

(9) Optical switching;

(10) Employing Asynchronous Transfer Mode (ATM) techniques;

(11) Containing stored programme controlled digital crossconnect equipment with a digital transfer rate exceeding 8.5 Mbit/s per port;

(d) Centralized network control having both of the following characteristics:

(1) Receives data from the nodes; and

(2) Processes these data in order to provide control of traffic not requiring operator decisions, thereby performing dynamic adaptive routing;

Note: Head d. of this entry does not include the characteristic of control of traffic as a function of predictable statistical traffic conditions.

(e) Optical fibre communication cables, optical fibres and accessories, as follows:

(1) Optical fibres or cables of more than 50 m in length having either of the following characteristics:

(a) Designed for single mode operation; or

(b) For optical fibres, capable of withstanding a Proof Test tensile stress of 2 × 10⁹ N/m² or more;

Note: Proof Test: On-line or off-line production screen testing that dynamically applies a prescribed tensile stress over a 0.5 to 3 m length of fibre at a running rate of 2 to 5 m/s while passing between capstans approximately 150 mm in diameter. The ambient temperature is a nominal 293 K (20°C) and relative humidity 40%.

(2) Optical fibre cables and accessories designed for underwater use[^f00047];

(f) Phased array antennae, operating above 10.5 GHz, containing active elements and distributed components, and designed to permit electronic control of beam shaping and pointing.

Note: Head f. of this entry does not specify landing systems with instruments meeting International Civil Aviation Organisation (ICAO) standards (microwave landing systems (MLS)), published by ICAO in Annex 10 of Volume 1.

(5A101) Telemetering and telecontrol equipment usable for missiles.

Note: This entry does not specify equipment specially designed to be used for remote control of model planes, boats or vehicles and having an electric field strength of not more than 200 microvolts per metre at a distance of 500 m.

(5A990) The export of goods specified in this entry is prohibited to any destination in Iran, Iraq or Libya.

Tropospheric scatter communication equipment using analogue or digital modulation techniques.

5B1

Test, Inspection and Production Equipment

(5B001)

(a) Equipment and specially designed components and accessories therefor, specially designed for:

(1) Development of equipment, materials, functions or features specified in entries 5A001, 5B001, 5C001, 5D001 or 5E001, including measuring or test equipment;

(2) Production of equipment, materials, functions or features specified in entries 5A001, 5B001, 5C001, 5D001 or 5E001, including measuring, test or repair equipment;

(3) Use of equipment, materials, functions or features exceeding any of the least stringent export control requirements specified in entries 5A001, 5B001, 5C001, 5D001 or 5E001, including measuring, test or repair equipment;

Note: Head a. of this entry does not specify optical fibres and optical fibre preform characterisation equipment not using semiconductor lasers.

(b) Other equipment as follows:

(1) Bit error rate (BER) test equipment designed or modified to test the equipment specified in sub-head b.1. of entry 5A001;

(2) Data communication protocol analyzers, testers and simulators specially designed for functions specified in entry 5A001;

(3) Stand alone stored programme controlled radio transmission media simulators/channel estimators specially designed for testing equipment specified in sub-head b.5. of entry 5A001.

5C1

Materials

(5C001) Preforms of glass or of any other material optimized for the manufacture of optical fibres specified in head e. of entry 5A001.

5D1

Software[^f00048]

(5D001)

(a) Software specially designed or modified for the development, production or use of goods specified in entries 5A001, 5B001 or 5C001;

(b) Software specially designed or modified to support technology specified in entry 5E001;

(1) Generic software, other than in machine-executable form, specially designed or modified for the use of stored programme controlled digital switching equipment or systems;

(2) Software, other than in machine-executable form, specially designed or modified for the use of digital cellular radio equipment or systems;

(3) Software specially designed or modified to provide characteristics, functions or features of equipment specified in entries 5A001 or 5B001;

(4) Software which provides the capability of recovering source code of telecommunications software specified in this Category;

(5) Software specially designed for the development or production of software specified in this entry.

5E1

Technology

(5E001)

(a) Technology required for the development, production or use (excluding operation) of goods specified in entries 5A001, 5B001, 5C001 or 5D001;

(b) Specific technologies, as follows:

(1) Required technology for the development or production of telecommunications equipment specially designed to be used on board satellites;

(2) Technology for the development or use of laser communication techniques with the capability of automatically acquiring and tracking signals and maintaining communications through exoatmosphere or sub-surface (water) media;

(3) Technology for the processing and application of coatings to optical fibre specially designed to make it suitable for underwater use;

(4) Technology for the development or production of equipment employing Synchronous Digital Hierarchy (SDH) or Synchronous Optical Network (SONET) techniques;

(5) Technology for the development or production of switch fabric exceeding 64,000 bit/s per information channel other than for digital cross connect integrated in the switch;

(6) Technology for the development or production of centralized network control;

(7) Technology for the development or production of digital cellular radio systems;

(8) Technology for the development or production of Integrated Services Digital Network (ISDN);

(9) Technology for the development of QAM techniques, for radio equipment, above level 4.

(5E101) Technology required for the development, production or use of goods specified in entry 5A101.

(5E990) The export of goods specified in this entry is prohibited to any destination in Iran, Iraq or Libya.

Technology required for the development, production or use of goods specified in entry 5A990.

Part 2 — — Information Security

Note: Information security equipment, software, systems, application specific electronic assemblies, modules, integrated circuits, components or functions are specified in this Category even if they are components or electronic assemblies of other equipment.

5A2

Equipment, Assemblies and Components

(5A002) Systems, equipment, application specific electronic assemblies, modules or integrated circuits for information security, as follows, and other specially designed components therefor:

(a) Designed or modified to use cryptography employing digital techniques to ensure information security;

(b) Designed or modified to perform cryptanalytic functions;

except: Equipment using fixed band scrambling not exceeding 8 bands and in which the transpositions change not more frequently than once every second; Equipment using fixed band scrambling exceeding 8 bands and in which the transpositions change not more frequently than once every ten seconds; Equipment using fixed frequency inversion and in which the transpositions change not more frequently than once every second; Facsimile equipment; Restricted audience broadcast equipment; Civil television equipment;

(d) Designed or modified to suppress the compromising emanations of information-bearing signals;

Note: Head d. of this entry does not specify equipment specially designed to suppress emanations for health or safety reasons.

(e) Designed or modified to use cryptographic techniques to generate the spreading code for spread spectrum or the hopping code for frequency agility systems;

(f) Designed or modified to provide certified or certifiable multilevel security or user isolation at a level exceeding Class B2 of the Trusted Computer System Evaluation Criteria (TCSEC);

(g) Communications cable systems which are designed or modified to use mechanical, electrical or electronic means to detect surreptitious intrusion.

Note: This entry does not specify: Personalized smart cards using cryptography restricted for use only in equipment or systems as follows: Excluded from control under sub-heads c.1. to c.6. of entry 5A002; Excluded from control under heads b. to e. of this Note; or Cellular radio equipment or systems specially designed for cryptographic operation, provided any message traffic encryption capability specified in entry 5A002 contained in such equipment or systems is irreversibly disabled; Access control equipment, such as automatic teller machines, self-service statement printers or point of sale terminals, which protects password or personal identification numbers (PIN) or similar data to prevent unauthorised access to facilities but does not allow for encryption of files or text, except as directly related to the password or PIN protection; Data authentication equipment which calculates a Message Authentication Code (MAC) or similar result to ensure no alteration of text has taken place, or to authenticate users, but does not allow for encryption of data, text or other media other than that needed for the authentication; Cryptographic equipment specially designed, developed or modified for use in machines for banking or money transactions, such as automatic teller machines, self-service statement printers, point of sale terminals, or equipment for the encryption of interbanking transactions, and intended for use only in such applications; Equipment containing fixed data compression or coding techniques; Receiving equipment for radio broadcast, pay television or similar restricted audience television of the consumer type, without digital encryption and where digital decryption is limited to the video, audio or management functions; Portable (personal) or mobile radiotelephones for civil use, e.g., for use with commercial civil cellular radiocommunications systems, containing encryption, when accompanying their users; Decryption functions specially designed to allow the execution of copy-protected software, provided the decryption functions are not user-accessible.

5B2

Test, Inspection and Production Equipment

(5B002)

(a) Equipment specially designed for:

(1) The development of equipment or functions specified in entries 5A002, 5B002, 5D002 or 5E002, including measuring or test equipment;

(2) The production of equipment or functions specified in entries 5A002, 5B002, 5D002 or 5E002, including measuring, test, repair or production equipment;

(b) Measuring equipment specially designed to evaluate and validate the information security functions specified in entries 5A002 or 5D002.

5C2

Materials

None

5D2

Software

(5D002)

(a) Software specially designed or modified for the development, production or use of equipment or software specified in entries 5A002, 5B002 or 5D002;

(b) Software specially designed or modified to support technology specified in entry 5E002;

(1) Software having the characteristics, or performing or simulating the functions of the equipment specified in entries 5A002 or 5B002;

(2) Software to certify software specified in sub-head c.1. of this entry;

(3) Software designed or modified to protect against malicious computer damage, e.g., viruses.

Note: This entry does not specify software required for the use of equipment described in the Note to 5A002 or providing any of the functions of that equipment 5A002.

5E2

Technology

(5E002) Technology required for the development, production or use of goods specified in entries 5A002, 5B002 or 5D002.

Category 6 — Sensors and Lasers

Equipment, Assemblies and Components

6A

6A1

Acoustics

(6A001)

(a) Marine acoustic systems, equipment or specially designed components therefor, as follows:

(1) Active (transmitting or transmitting-and-receiving) systems, equipment or specially designed components therefor, as follows:

Note: Sub-head a.1. to this entry does not specify:

(a) Depth sounders operating vertically below the apparatus, not including a scanning function exceeding ± 10°, and limited to measuring the depth of water, the distance of submerged or buried objects or fish finding;

(b) Acoustic beacons, as follows:

(1) Acoustic emergency beacons; or

(2) Pingers specially designed for relocating or returning to an underwater position.

(a) Wide-swath bathymetric survey systems for sea bed topographic mapping:

(1) Designed:

(a) To take measurements at an angle exceeding 10° from the vertical; and

(b) To measure depths exceeding 600 m below the water surface; and

(2) Designed:

(a) To incorporate multiple beams any of which is less than 2°; or

(b) To provide data accuracies of better than 0.5% of water depth across the swath averaged over the individual measurements within the swath;

(b) Object detection or location systems having any of the following:

(1) A transmitting frequency below 10 kHz;

(2) Sound pressure level exceeding 224 dB (reference 1 micropascal at 1 m) for equipment with an operating frequency in the band from 10 kHz to 24 kHz inclusive;

(3) Sound pressure level exceeding 235 dB (reference 1 micropascal at 1m) for equipment with an operating frequency in the band between 24 kHz and 30 kHz;

(4) Forming beams of less than 1° on any axis and having an operating frequency of less than 100 kHz;

(5) Designed to withstand pressure during normal operation at depths exceeding 1,000 m and having transducers:

(a) Dynamically compensated for pressure; or

(b) Incorporating other than lead zirconate titanate as the transduction element; or

(6) Designed to operate with an unambiguous display range exceeding 5,120 m;

(c) Acoustic projectors, including transducers, incorporating piezoelectric, magnetostrictive, electrostrictive, electrodynamic or hydraulic elements operating individually or in a designed combination, having any of the following:

Notes:

(1) The control on export of acoustic projectors, including transducers, specially designed for other equipment is determined by the export control requirements applying to that equipment.

(2) Sub-head a.1.c. of this entry does not specify electronic sources which direct the sound vertically only, or mechanical (e.g., air gun or vapour-shock gun) or chemical (e.g., explosive) sources.

(1) An instantaneous radiated acoustic power density exceeding 0.01 mW/mm²/Hz for devices operating at frequencies below 10 kHz;

(2) A continuously radiated acoustic power density exceeding 0.001 mW/mm²/Hz for devices operating at frequencies below 10 kHz;

Note: Acoustic power density is obtained by dividing the output acoustic power by the product of the area of the radiating surface and the frequency of operation.

(3) Designed to withstand pressure during normal operation at depths exceeding 1,000 m; or

(4) Side-lobe suppression exceeding 22 dB;

(d) Acoustic systems, equipment or specially designed components for determining the position of surface vessels or underwater vehicles designed:

Note: Sub-head a.1.d. of this entry includes equipment using coherent signal processing between two or more beacons and the hydrophone unit carried by the surface vessel or underwater vehicle, or capable of automatically correcting speed-of-sound propagation errors for calculation of a point.

(1) To operate at a range exceeding 1,000 m with a positioning accuracy of less than 10 m rms when measured at a range of 1,000 m; or

(2) To withstand pressure at depths exceeding 1,000 m;

(2) Passive (receiving, whether or not related in normal application to separate active equipment) systems, equipment or specially designed components therefor, as follows:

(a) Hydrophones (transducers) with any of the following characteristics:

(1) Incorporating continuous flexible sensors or assemblies of discrete sensor elements with either a diameter or length less than 20 mm and with a separation between elements of less than 20 mm;

(2) Having any of the following sensing elements:

(a) Optical fibres;

(b) Piezoelectric polymers; or

(3) Hydrophone sensitivity better than -180 dB at any depth with no acceleration compensation;

(4) When designed to operate at depths not exceeding 35 m, hydrophone sensitivity better than -186 dB with acceleration compensation;

(5) When designed for normal operation at depths exceeding 35 m, hydrophone sensitivity better than -192 dB with acceleration compensation;

(6) When designed for normal operation at depths exceeding 100 m, hydrophone sensitivity better than -204 dB; or

(7) Designed for operation at depths exceeding 1,000 m;

Note: Hydrophone sensitivity is defined as twenty times the logarithm to the base 10 of the ratio of rms output voltage to a 1 V rms reference, when the hydrophone sensor, without a pre-amplifier, is placed in a plane wave acoustic field with an rms pressure of 1 micropascal. For example, a hydrophone of -160 dB (reference 1 V per micropascal) would yield an output voltage of 10−8 V in such a field, while one of -180 dB sensitivity would yield only 10−9 V output. Thus, -160 dB is better than -180 dB.

(b) Towed acoustic hydrophone arrays with any of the following:

(1) Hydrophone group spacing of less than 12.5 m;

(2) Hydrophone group spacing of 12.5 m to less than 25 m and designed or able to be modified to operate at depths exceeding 35 m;

Note: In this sub-head, “Able to be modified” means having provisions to allow a change of the wiring or interconnections to alter hydrophone group spacing or operating depth limits. These provisions are: spare wiring exceeding 10% of the number of wires, hydrophone group spacing adjustment blocks or internal depth limiting devices that are adjustable or that control more than one hydrophone group.

(3) Hydrophone group spacing of 25 m or more and designed to operate at depths exceeding 100 m;

(4) Heading sensors specified in sub-head a.2.d. of this entry;

(5) Non-metallic strength members or longitudinally reinforced array hoses;

(6) An assembled array of less than 40 mm in diameter;

(7) Multiplexed hydrophone group signals; or

(8) Hydrophone characteristics specified in sub-head a.2.a. of this entry;

(1) A Fast Fourier or other transform of 1,024 or more complex points in less than 20 ms with no user-accessible programmability; or

(2) Time or frequency domain processing and correlation, including spectral analysis, digital filtering and beamforming using Fast Fourier or other transforms or processes with user-accessible programmability;

(d) Heading sensors having an accuracy of better than ± 0.5°; and

(1) Designed to be incorporated within the array hosing and to operate at depths exceeding 35 m or having an adjustable or removable depth sensing device in order to operate at depths exceeding 35 m; or

(2) Designed to be mounted external to the array hosing and having a sensor unit capable of operating with 360° roll at depths exceeding 35 m;

(b) Terrestrial geophones capable of conversion for use in marine systems, equipment or specially designed components specified in sub-head a.2.a. of this entry;

(c) Correlation-velocity sonar log equipment designed to measure the horizontal speed of the equipment carrier relative to the sea bed at distances between the carrier and the sea bed exceeding 500 m.

(6A002) Optical sensors

Optical detectors, as follows[^f00049]: Note: Head a. of this entry does not specify germanium or silicon photodevices. Space-qualified solid state detectors having any of the following: A peak response in the wavelength range exceeding 10 nm but not exceeding 300 nm; and A response of less than 0.1% relative to the peak response at a wavelength exceeding 400 nm; A peak response in the wavelength range exceeding 900 nm but not exceeding 1,200 nm; and A response time constant of 95 ns or less; or A peak response in the wavelength range exceeding 1,200 nm but not exceeding 30,000 nm; Image intensifier tubes and specially designed components therefor, as follows: Image intensifier tubes having all of the following: A peak response in the wavelength range exceeding 400 nm but not exceeding 1,050 nm; A microchannel plate for electron image amplification with a hole pitch (centre-to-centre spacing) of less than 25 micrometres; and An S-20, S-25 or multialkali photocathode; or A GaAs or GaInAs photocathode; Specially designed components, as follows: Fibre optic image inverters; Microchannel plates having both of the following characteristics: 15,000 or more hollow tubes per plate; and Hole pitch (centre-to-centre spacing) of less than 25 micro-metres; GaAs or GaInAs photocathodes; Non-space-qualified focal plane arrays, having any of the following: Notes: Linear or two-dimensional multi-element detector arrays are referred to as focal plane arrays. Sub-head a.3. of this entry includes photoconductive arrays and photovoltaic arrays. Sub-head a.3. of this entry does not specify silicon focal plane arrays, multi-element (not to exceed 16 elements) encapsulated photoconductive cells or pyroelectric detectors using any of the following: Lead sulphide; Triglycine sulphate and variants; Lead-lanthanum-zirconium titanate and variants; Lithium tantalate; Polyvinylidene fluoride and variants; Strontium barium niobate and variants; or Lead selenide. Individual elements with a peak response within the wavelength range exceeding 900 nm but not exceeding 1,050 nm; and A response time constant of less than 0.5 ns; Individual elements with a peak response in the wavelength range exceeding 1,050 nm but not exceeding 1,200 nm; and A response time constant of 95 ns or less; or Individual elements with a peak response in the wavelength range exceeding 1,200 nm but not exceeding 30,000 nm; Non-space-qualified single-element or non-focal-plane multi-element semi-conductor photodiodes or phototransistors having both of the following: A peak response in the wavelength range exceeding 1,200 nm but not exceeding 30,000 nm; and A response time constant of 0.5 ns or less;

Multispectral imaging sensors designed for remote sensing applications, having either of the following characteristics: An Instantaneous-Field-Of-View (IFOV) of less than 200 microradians; or Specified for operation in the wavelength range exceeding 400 nm but not exceeding 30,000 nm; and Providing output imaging data in digital format; and Space-qualified; or Designed for airborne operation, using other than silicon detectors, and having an IFOV of less than 2.5 milliradians;

Direct view imaging equipment operating in the visible or infrared spectrum, incorporating either of the following: Image intensifier tubes having the characteristics listed in sub-head a.2.a. of this entry; or Focal plane arrays having the characteristics listed in sub-head a.3. of this entry; Notes: In this entry “direct view” means imaging equipment, operating in the visible or infrared spectrum, that presents a visual image to a human observer without converting the image into an electronic signal for television display, and that cannot record or store the image photographically, electronically or by any other means. Head c. of this entry does not specify the following equipment incorporating other than GaAs or GaInAs photocathodes: Industrial or civilian intrusion alarm, traffic or industrial movement control or counting systems; Medical equipment; Industrial equipment used for inspection, sorting or analysis of the properties of materials; Flame detectors for industrial furnaces; Equipment specially designed for laboratory use.

Special support components for optical sensors, as follows: Space-qualified cryocoolers; Non-space-qualified cryocoolers with a cooling source temperature below 218 K (-55°C), as follows: Closed cycle with a specified Mean-Time-To-Failure (MTTF), or Mean-Time-Between-Failures (MTBF), exceeding 2,500 hours; Joule-Thomson (JT) self-regulating minicoolers with bore (outside) diameters of less than 8 mm; Optical sensing fibres: Specially fabricated either compositionally or structurally, or modified by coating, to be acoustically, thermally, inertially, electromagnetically or nuclear radiation sensitive; or Modified structurally to have a beat length of less than 50 mm (high birefringence).

(6A003) Cameras[^f00050]

(a) Instrumentation cameras, as follows:

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