LegalizeThe Russia (Sanctions) (EU Exit) Regulations 2019
| 3A991 Electronic devices and components | 3A991 Electronic devices and components | 3A991 Electronic devices and components | 3A991 Electronic devices and components | 3A991 Electronic devices and components | 3A991 Electronic devices and components | 3A991 Electronic devices and components |
|---|---|---|---|---|---|---|
| b.1. “Stored program controlled” inspection equipment for the automatic detection of defects, errors or contaminants of 0.6 μm or less in or on processed wafers, “substrates”, other than printed circuit boards or integrated circuits, using optical image acquisition techniques for pattern comparison;Note: 3B992.b.1 does not control general purpose scanning electron microscopes, except when specially designed and instrumented for automatic pattern inspection. | b.1. “Stored program controlled” inspection equipment for the automatic detection of defects, errors or contaminants of 0.6 μm or less in or on processed wafers, “substrates”, other than printed circuit boards or integrated circuits, using optical image acquisition techniques for pattern comparison;Note: 3B992.b.1 does not control general purpose scanning electron microscopes, except when specially designed and instrumented for automatic pattern inspection. | b.1. “Stored program controlled” inspection equipment for the automatic detection of defects, errors or contaminants of 0.6 μm or less in or on processed wafers, “substrates”, other than printed circuit boards or integrated circuits, using optical image acquisition techniques for pattern comparison;Note: 3B992.b.1 does not control general purpose scanning electron microscopes, except when specially designed and instrumented for automatic pattern inspection. | b.1. “Stored program controlled” inspection equipment for the automatic detection of defects, errors or contaminants of 0.6 μm or less in or on processed wafers, “substrates”, other than printed circuit boards or integrated circuits, using optical image acquisition techniques for pattern comparison;Note: 3B992.b.1 does not control general purpose scanning electron microscopes, except when specially designed and instrumented for automatic pattern inspection. | b.1. “Stored program controlled” inspection equipment for the automatic detection of defects, errors or contaminants of 0.6 μm or less in or on processed wafers, “substrates”, other than printed circuit boards or integrated circuits, using optical image acquisition techniques for pattern comparison;Note: 3B992.b.1 does not control general purpose scanning electron microscopes, except when specially designed and instrumented for automatic pattern inspection. | ||
| b.2. Specially designed “stored program controlled” measuring and analysis equipment, as follows: | b.2. Specially designed “stored program controlled” measuring and analysis equipment, as follows: | b.2. Specially designed “stored program controlled” measuring and analysis equipment, as follows: | b.2. Specially designed “stored program controlled” measuring and analysis equipment, as follows: | b.2. Specially designed “stored program controlled” measuring and analysis equipment, as follows: | ||
| b.2.a. Specially designed for the measurement of oxygen or carbon content in semiconductor materials; | b.2.a. Specially designed for the measurement of oxygen or carbon content in semiconductor materials; | b.2.a. Specially designed for the measurement of oxygen or carbon content in semiconductor materials; | ||||
| b.2.b. Equipment for line width measurement with a resolution of 1 μm or finer; | b.2.b. Equipment for line width measurement with a resolution of 1 μm or finer; | b.2.b. Equipment for line width measurement with a resolution of 1 μm or finer; | ||||
| b.2.c. Specially designed flatness measurement instruments capable of measuring deviations from flatness of 10 μm or less with a resolution of 1 μm or finer. | b.2.c. Specially designed flatness measurement instruments capable of measuring deviations from flatness of 10 μm or less with a resolution of 1 μm or finer. | b.2.c. Specially designed flatness measurement instruments capable of measuring deviations from flatness of 10 μm or less with a resolution of 1 μm or finer. | ||||
| b.3. “Stored program controlled” wafer probing equipment having any of the following: | b.3. “Stored program controlled” wafer probing equipment having any of the following: | b.3. “Stored program controlled” wafer probing equipment having any of the following: | b.3. “Stored program controlled” wafer probing equipment having any of the following: | |||
| b.3.a. Positioning accuracy finer than 3.5 μm; | b.3.a. Positioning accuracy finer than 3.5 μm; | b.3.a. Positioning accuracy finer than 3.5 μm; | ||||
| b.3.b. Capable of testing devices having more than 68 terminals; or | b.3.b. Capable of testing devices having more than 68 terminals; or | b.3.b. Capable of testing devices having more than 68 terminals; or | ||||
| b.3.c. Capable of testing at a frequency exceeding 1 GHz; | b.3.c. Capable of testing at a frequency exceeding 1 GHz; | b.3.c. Capable of testing at a frequency exceeding 1 GHz; | ||||
| b.4. Test equipment as follows: | b.4. Test equipment as follows: | b.4. Test equipment as follows: | b.4. Test equipment as follows: | |||
| b.4.a. “Stored program controlled” equipment, specially designed for testing discrete semiconductor devices and unencapsulated dice, capable of testing at frequencies exceeding 18 GHz;Technical Note: Discrete semiconductor devices include photocells and solar cells. | b.4.a. “Stored program controlled” equipment, specially designed for testing discrete semiconductor devices and unencapsulated dice, capable of testing at frequencies exceeding 18 GHz;Technical Note: Discrete semiconductor devices include photocells and solar cells. | b.4.a. “Stored program controlled” equipment, specially designed for testing discrete semiconductor devices and unencapsulated dice, capable of testing at frequencies exceeding 18 GHz;Technical Note: Discrete semiconductor devices include photocells and solar cells. | b.4.a. “Stored program controlled” equipment, specially designed for testing discrete semiconductor devices and unencapsulated dice, capable of testing at frequencies exceeding 18 GHz;Technical Note: Discrete semiconductor devices include photocells and solar cells. | |||
| b.4.b. “Stored program controlled” equipment specially designed for testing integrated circuits and “electronic assemblies” thereof, capable of functional testing: | b.4.b. “Stored program controlled” equipment specially designed for testing integrated circuits and “electronic assemblies” thereof, capable of functional testing: | b.4.b. “Stored program controlled” equipment specially designed for testing integrated circuits and “electronic assemblies” thereof, capable of functional testing: | b.4.b. “Stored program controlled” equipment specially designed for testing integrated circuits and “electronic assemblies” thereof, capable of functional testing: | |||
| b.4.b.1. At a ‘pattern rate’ exceeding 20 MHz; or | b.4.b.1. At a ‘pattern rate’ exceeding 20 MHz; or | b.4.b.1. At a ‘pattern rate’ exceeding 20 MHz; or | ||||
| b.4.b.2. At a ‘pattern rate’ exceeding 10 MHz but not exceeding 20 MHz and capable of testing packages of more than 68 terminals. | b.4.b.2. At a ‘pattern rate’ exceeding 10 MHz but not exceeding 20 MHz and capable of testing packages of more than 68 terminals. | b.4.b.2. At a ‘pattern rate’ exceeding 10 MHz but not exceeding 20 MHz and capable of testing packages of more than 68 terminals. | ||||
| Notes: 3B992.b.4.b does not control test equipment specially designed for testing:1. Memory;2. “Electronic assemblies” for home and entertainment applications; and3. Electronic components, and integrated circuits not controlled by entry 3A001 of Annex I of the Dual-Use Regulation or 3A991 provided such test equipment does not incorporate computing facilities with “user accessible programmability”.Technical Note: For purposes of 3B992.b.4.b, ‘pattern rate’ is defined as the maximum frequency of digital operation of a tester. It is therefore equivalent to the highest data rate that a tester can provide in non-multiplexed mode. It is also referred to as test speed, maximum digital frequency or maximum digital speed. | Notes: 3B992.b.4.b does not control test equipment specially designed for testing:1. Memory;2. “Electronic assemblies” for home and entertainment applications; and3. Electronic components, and integrated circuits not controlled by entry 3A001 of Annex I of the Dual-Use Regulation or 3A991 provided such test equipment does not incorporate computing facilities with “user accessible programmability”.Technical Note: For purposes of 3B992.b.4.b, ‘pattern rate’ is defined as the maximum frequency of digital operation of a tester. It is therefore equivalent to the highest data rate that a tester can provide in non-multiplexed mode. It is also referred to as test speed, maximum digital frequency or maximum digital speed. | Notes: 3B992.b.4.b does not control test equipment specially designed for testing:1. Memory;2. “Electronic assemblies” for home and entertainment applications; and3. Electronic components, and integrated circuits not controlled by entry 3A001 of Annex I of the Dual-Use Regulation or 3A991 provided such test equipment does not incorporate computing facilities with “user accessible programmability”.Technical Note: For purposes of 3B992.b.4.b, ‘pattern rate’ is defined as the maximum frequency of digital operation of a tester. It is therefore equivalent to the highest data rate that a tester can provide in non-multiplexed mode. It is also referred to as test speed, maximum digital frequency or maximum digital speed. | Notes: 3B992.b.4.b does not control test equipment specially designed for testing:1. Memory;2. “Electronic assemblies” for home and entertainment applications; and3. Electronic components, and integrated circuits not controlled by entry 3A001 of Annex I of the Dual-Use Regulation or 3A991 provided such test equipment does not incorporate computing facilities with “user accessible programmability”.Technical Note: For purposes of 3B992.b.4.b, ‘pattern rate’ is defined as the maximum frequency of digital operation of a tester. It is therefore equivalent to the highest data rate that a tester can provide in non-multiplexed mode. It is also referred to as test speed, maximum digital frequency or maximum digital speed. | |||
| b.4.c. Equipment specially designed for determining the performance of focal-plane arrays at wavelengths of more than 1,200 nm, using “stored program controlled” measurements or computer aided evaluation and having any of the following: | b.4.c. Equipment specially designed for determining the performance of focal-plane arrays at wavelengths of more than 1,200 nm, using “stored program controlled” measurements or computer aided evaluation and having any of the following: | b.4.c. Equipment specially designed for determining the performance of focal-plane arrays at wavelengths of more than 1,200 nm, using “stored program controlled” measurements or computer aided evaluation and having any of the following: | b.4.c. Equipment specially designed for determining the performance of focal-plane arrays at wavelengths of more than 1,200 nm, using “stored program controlled” measurements or computer aided evaluation and having any of the following: | |||
| b.4.c.1. Using scanning light spot diameters of less than 0.12 mm; | b.4.c.1. Using scanning light spot diameters of less than 0.12 mm; | b.4.c.1. Using scanning light spot diameters of less than 0.12 mm; | ||||
| b.4.c.2. Designed for measuring photosensitive performance parameters and for evaluating frequency response, modulation transfer function, uniformity of responsivity or noise; or | b.4.c.2. Designed for measuring photosensitive performance parameters and for evaluating frequency response, modulation transfer function, uniformity of responsivity or noise; or | b.4.c.2. Designed for measuring photosensitive performance parameters and for evaluating frequency response, modulation transfer function, uniformity of responsivity or noise; or | ||||
| b.4.c.3. Designed for evaluating arrays capable of creating images with more than 32 x 32 line elements; | b.4.c.3. Designed for evaluating arrays capable of creating images with more than 32 x 32 line elements; | b.4.c.3. Designed for evaluating arrays capable of creating images with more than 32 x 32 line elements; | ||||
| b.5. Electron beam test systems designed for operation at 3 keV or below, or “laser” beam systems, for non-contact probing of powered-up semiconductor devices having any of the following: | b.5. Electron beam test systems designed for operation at 3 keV or below, or “laser” beam systems, for non-contact probing of powered-up semiconductor devices having any of the following: | b.5. Electron beam test systems designed for operation at 3 keV or below, or “laser” beam systems, for non-contact probing of powered-up semiconductor devices having any of the following: | b.5. Electron beam test systems designed for operation at 3 keV or below, or “laser” beam systems, for non-contact probing of powered-up semiconductor devices having any of the following: | b.5. Electron beam test systems designed for operation at 3 keV or below, or “laser” beam systems, for non-contact probing of powered-up semiconductor devices having any of the following: | ||
| b.5.a. Stroboscopic capability with either beam blanking or detector strobing; | b.5.a. Stroboscopic capability with either beam blanking or detector strobing; | b.5.a. Stroboscopic capability with either beam blanking or detector strobing; | b.5.a. Stroboscopic capability with either beam blanking or detector strobing; | |||
| b.5.b. An electron spectrometer for voltage measurements with a resolution of less than 0.5 V; or | b.5.b. An electron spectrometer for voltage measurements with a resolution of less than 0.5 V; or | b.5.b. An electron spectrometer for voltage measurements with a resolution of less than 0.5 V; or | b.5.b. An electron spectrometer for voltage measurements with a resolution of less than 0.5 V; or | |||
| b.5.c. Electrical tests fixtures for performance analysis of integrated circuits; | b.5.c. Electrical tests fixtures for performance analysis of integrated circuits; | b.5.c. Electrical tests fixtures for performance analysis of integrated circuits; | b.5.c. Electrical tests fixtures for performance analysis of integrated circuits; | |||
| Note:3B992.b.5 does not control scanning electron microscopes, except when specially designed and instrumented for non-contact probing of a powered-up semiconductor device. | Note:3B992.b.5 does not control scanning electron microscopes, except when specially designed and instrumented for non-contact probing of a powered-up semiconductor device. | Note:3B992.b.5 does not control scanning electron microscopes, except when specially designed and instrumented for non-contact probing of a powered-up semiconductor device. | Note:3B992.b.5 does not control scanning electron microscopes, except when specially designed and instrumented for non-contact probing of a powered-up semiconductor device. | Note:3B992.b.5 does not control scanning electron microscopes, except when specially designed and instrumented for non-contact probing of a powered-up semiconductor device. | ||
| b.6. “Stored program controlled” multifunctional focused ion beam systems specially designed for manufacturing, repairing, physical layout analysis and testing of masks or semiconductor devices and having either of the following: | b.6. “Stored program controlled” multifunctional focused ion beam systems specially designed for manufacturing, repairing, physical layout analysis and testing of masks or semiconductor devices and having either of the following: | b.6. “Stored program controlled” multifunctional focused ion beam systems specially designed for manufacturing, repairing, physical layout analysis and testing of masks or semiconductor devices and having either of the following: | b.6. “Stored program controlled” multifunctional focused ion beam systems specially designed for manufacturing, repairing, physical layout analysis and testing of masks or semiconductor devices and having either of the following: | b.6. “Stored program controlled” multifunctional focused ion beam systems specially designed for manufacturing, repairing, physical layout analysis and testing of masks or semiconductor devices and having either of the following: | ||
| b.6.a. Target-to-beam position feedback control precision of 1 μm or finer; or | b.6.a. Target-to-beam position feedback control precision of 1 μm or finer; or | b.6.a. Target-to-beam position feedback control precision of 1 μm or finer; or | b.6.a. Target-to-beam position feedback control precision of 1 μm or finer; or | |||
| b.6.b. Digital-to-analogue conversion accuracy exceeding 12 bit; | b.6.b. Digital-to-analogue conversion accuracy exceeding 12 bit; | b.6.b. Digital-to-analogue conversion accuracy exceeding 12 bit; | b.6.b. Digital-to-analogue conversion accuracy exceeding 12 bit; | |||
| b.7. Particle measuring systems employing “lasers” designed for measuring particle size and concentration in air having both of the following: | b.7. Particle measuring systems employing “lasers” designed for measuring particle size and concentration in air having both of the following: | b.7. Particle measuring systems employing “lasers” designed for measuring particle size and concentration in air having both of the following: | b.7. Particle measuring systems employing “lasers” designed for measuring particle size and concentration in air having both of the following: | b.7. Particle measuring systems employing “lasers” designed for measuring particle size and concentration in air having both of the following: | ||
| b.7.a. Capable of measuring particle sizes of 0.2 μm or less at a flow rate of 0.02832 m³ per minute or more; and | b.7.a. Capable of measuring particle sizes of 0.2 μm or less at a flow rate of 0.02832 m³ per minute or more; and | b.7.a. Capable of measuring particle sizes of 0.2 μm or less at a flow rate of 0.02832 m³ per minute or more; and | b.7.a. Capable of measuring particle sizes of 0.2 μm or less at a flow rate of 0.02832 m³ per minute or more; and | |||
| b.7.b. Capable of characterising Class 10 clean air or better. | b.7.b. Capable of characterising Class 10 clean air or better. | b.7.b. Capable of characterising Class 10 clean air or better. | b.7.b. Capable of characterising Class 10 clean air or better. | |||
| 3B993 Equipment for the manufacture of Printed Circuit Boards (PCBs) and specially designed components and accessories therefor, as follows: | 3B993 Equipment for the manufacture of Printed Circuit Boards (PCBs) and specially designed components and accessories therefor, as follows: | 3B993 Equipment for the manufacture of Printed Circuit Boards (PCBs) and specially designed components and accessories therefor, as follows: | 3B993 Equipment for the manufacture of Printed Circuit Boards (PCBs) and specially designed components and accessories therefor, as follows: | 3B993 Equipment for the manufacture of Printed Circuit Boards (PCBs) and specially designed components and accessories therefor, as follows: | 3B993 Equipment for the manufacture of Printed Circuit Boards (PCBs) and specially designed components and accessories therefor, as follows: | 3B993 Equipment for the manufacture of Printed Circuit Boards (PCBs) and specially designed components and accessories therefor, as follows: |
| a. Film processing equipment; | a. Film processing equipment; | a. Film processing equipment; | a. Film processing equipment; | a. Film processing equipment; | a. Film processing equipment; | |
| b. Solder mask coating equipment; | b. Solder mask coating equipment; | b. Solder mask coating equipment; | b. Solder mask coating equipment; | b. Solder mask coating equipment; | b. Solder mask coating equipment; | |
| c. Photo plotter equipment; | c. Photo plotter equipment; | c. Photo plotter equipment; | c. Photo plotter equipment; | c. Photo plotter equipment; | c. Photo plotter equipment; | |
| d. Plating or electroplating deposition equipment; | d. Plating or electroplating deposition equipment; | d. Plating or electroplating deposition equipment; | d. Plating or electroplating deposition equipment; | d. Plating or electroplating deposition equipment; | d. Plating or electroplating deposition equipment; | |
| e. Vacuum chambers and presses; | e. Vacuum chambers and presses; | e. Vacuum chambers and presses; | e. Vacuum chambers and presses; | e. Vacuum chambers and presses; | e. Vacuum chambers and presses; | |
| f. Roll laminators; | f. Roll laminators; | f. Roll laminators; | f. Roll laminators; | f. Roll laminators; | f. Roll laminators; | |
| g. Alignment equipment; | g. Alignment equipment; | g. Alignment equipment; | g. Alignment equipment; | g. Alignment equipment; | g. Alignment equipment; | |
| h. Etching equipment. | h. Etching equipment. | h. Etching equipment. | h. Etching equipment. | h. Etching equipment. | h. Etching equipment. | |
| 3B994 Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: | 3B994 Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: | 3B994 Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: | 3B994 Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: | 3B994 Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: | 3B994 Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: | 3B994 Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: |
| a. Spacing, area, volume or height; | a. Spacing, area, volume or height; | a. Spacing, area, volume or height; | a. Spacing, area, volume or height; | a. Spacing, area, volume or height; | a. Spacing, area, volume or height; | |
| b. Bill boarding; | b. Bill boarding; | b. Bill boarding; | b. Bill boarding; | b. Bill boarding; | b. Bill boarding; | |
| c. Components (presence, absence, flipped, offset, polarity, or skew); | c. Components (presence, absence, flipped, offset, polarity, or skew); | c. Components (presence, absence, flipped, offset, polarity, or skew); | c. Components (presence, absence, flipped, offset, polarity, or skew); | c. Components (presence, absence, flipped, offset, polarity, or skew); | c. Components (presence, absence, flipped, offset, polarity, or skew); | |
| d. Solder (bridging, insufficient solder joints); | d. Solder (bridging, insufficient solder joints); | d. Solder (bridging, insufficient solder joints); | d. Solder (bridging, insufficient solder joints); | d. Solder (bridging, insufficient solder joints); | d. Solder (bridging, insufficient solder joints); | |
| e. Leads (insufficient paste, lifting); | e. Leads (insufficient paste, lifting); | e. Leads (insufficient paste, lifting); | e. Leads (insufficient paste, lifting); | e. Leads (insufficient paste, lifting); | e. Leads (insufficient paste, lifting); | |
| f. Tombstoning; or | f. Tombstoning; or | f. Tombstoning; or | f. Tombstoning; or | f. Tombstoning; or | f. Tombstoning; or | |
| g. Electrical (shorts, opens, resistance, capacitance, power, grid performance). | g. Electrical (shorts, opens, resistance, capacitance, power, grid performance). | g. Electrical (shorts, opens, resistance, capacitance, power, grid performance). | g. Electrical (shorts, opens, resistance, capacitance, power, grid performance). | g. Electrical (shorts, opens, resistance, capacitance, power, grid performance). | g. Electrical (shorts, opens, resistance, capacitance, power, grid performance). | |
| 3C992 Positive resists designed for semiconductor lithography specially adjusted (optimised) for use at wavelengths between 370 and 193 nm. | 3C992 Positive resists designed for semiconductor lithography specially adjusted (optimised) for use at wavelengths between 370 and 193 nm. | 3C992 Positive resists designed for semiconductor lithography specially adjusted (optimised) for use at wavelengths between 370 and 193 nm. | 3C992 Positive resists designed for semiconductor lithography specially adjusted (optimised) for use at wavelengths between 370 and 193 nm. | 3C992 Positive resists designed for semiconductor lithography specially adjusted (optimised) for use at wavelengths between 370 and 193 nm. | 3C992 Positive resists designed for semiconductor lithography specially adjusted (optimised) for use at wavelengths between 370 and 193 nm. | 3C992 Positive resists designed for semiconductor lithography specially adjusted (optimised) for use at wavelengths between 370 and 193 nm. |
| 3C993 Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: | 3C993 Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: | 3C993 Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: | 3C993 Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: | 3C993 Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: | 3C993 Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: | 3C993 Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: |
| a. PCB composite substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR-6, CEM-1,G-10, etc.); | a. PCB composite substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR-6, CEM-1,G-10, etc.); | a. PCB composite substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR-6, CEM-1,G-10, etc.); | a. PCB composite substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR-6, CEM-1,G-10, etc.); | a. PCB composite substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR-6, CEM-1,G-10, etc.); | a. PCB composite substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR-6, CEM-1,G-10, etc.); | |
| b. Multilayer PCB substrates, containing at least one layer of any of the following materials: | b. Multilayer PCB substrates, containing at least one layer of any of the following materials: | b. Multilayer PCB substrates, containing at least one layer of any of the following materials: | b. Multilayer PCB substrates, containing at least one layer of any of the following materials: | b. Multilayer PCB substrates, containing at least one layer of any of the following materials: | b. Multilayer PCB substrates, containing at least one layer of any of the following materials: | |
| b.1. Aluminium; | b.1. Aluminium; | b.1. Aluminium; | b.1. Aluminium; | b.1. Aluminium; | ||
| b.2. Polytetrafluoroethylene (PTFE); or | b.2. Polytetrafluoroethylene (PTFE); or | b.2. Polytetrafluoroethylene (PTFE); or | b.2. Polytetrafluoroethylene (PTFE); or | b.2. Polytetrafluoroethylene (PTFE); or | ||
| b.3. Ceramic materials (e.g. alumina, titanium oxide, etc.); | b.3. Ceramic materials (e.g. alumina, titanium oxide, etc.); | b.3. Ceramic materials (e.g. alumina, titanium oxide, etc.); | b.3. Ceramic materials (e.g. alumina, titanium oxide, etc.); | b.3. Ceramic materials (e.g. alumina, titanium oxide, etc.); | ||
| c. Etchant chemicals; | c. Etchant chemicals; | c. Etchant chemicals; | c. Etchant chemicals; | c. Etchant chemicals; | c. Etchant chemicals; | |
| c.1. Ferric chloride (7705-08-0); | c.1. Ferric chloride (7705-08-0); | c.1. Ferric chloride (7705-08-0); | c.1. Ferric chloride (7705-08-0); | c.1. Ferric chloride (7705-08-0); | ||
| c.2. Cupric chloride (7447-39-4); | c.2. Cupric chloride (7447-39-4); | c.2. Cupric chloride (7447-39-4); | c.2. Cupric chloride (7447-39-4); | c.2. Cupric chloride (7447-39-4); | ||
| c.3. Ammonium persulphate (7727-54-0); | c.3. Ammonium persulphate (7727-54-0); | c.3. Ammonium persulphate (7727-54-0); | c.3. Ammonium persulphate (7727-54-0); | c.3. Ammonium persulphate (7727-54-0); | ||
| c.4. Sodium persulphate (7775-27-1); | c.4. Sodium persulphate (7775-27-1); | c.4. Sodium persulphate (7775-27-1); | c.4. Sodium persulphate (7775-27-1); | c.4. Sodium persulphate (7775-27-1); | ||
| c.5. Chemical preparations specially designed for etching and containing any of the chemicals included in c.1 to c.4. | c.5. Chemical preparations specially designed for etching and containing any of the chemicals included in c.1 to c.4. | c.5. Chemical preparations specially designed for etching and containing any of the chemicals included in c.1 to c.4. | c.5. Chemical preparations specially designed for etching and containing any of the chemicals included in c.1 to c.4. | c.5. Chemical preparations specially designed for etching and containing any of the chemicals included in c.1 to c.4. | ||
| Note: 3C993.c. does not control “chemical mixtures” containing one or more of the chemicals specified in entry c. in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. | Note: 3C993.c. does not control “chemical mixtures” containing one or more of the chemicals specified in entry c. in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. | Note: 3C993.c. does not control “chemical mixtures” containing one or more of the chemicals specified in entry c. in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. | Note: 3C993.c. does not control “chemical mixtures” containing one or more of the chemicals specified in entry c. in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. | Note: 3C993.c. does not control “chemical mixtures” containing one or more of the chemicals specified in entry c. in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. | Note: 3C993.c. does not control “chemical mixtures” containing one or more of the chemicals specified in entry c. in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. | |
| d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; | d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; | d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; | d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; | d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; | d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; | |
| e. Polymeric substances and films thereof of less than 0.5 mm of thickness, as follows: | e. Polymeric substances and films thereof of less than 0.5 mm of thickness, as follows: | e. Polymeric substances and films thereof of less than 0.5 mm of thickness, as follows: | e. Polymeric substances and films thereof of less than 0.5 mm of thickness, as follows: | e. Polymeric substances and films thereof of less than 0.5 mm of thickness, as follows: | e. Polymeric substances and films thereof of less than 0.5 mm of thickness, as follows: | |
| e.1. Aromatic polyimides; | e.1. Aromatic polyimides; | e.1. Aromatic polyimides; | e.1. Aromatic polyimides; | e.1. Aromatic polyimides; | ||
| e.2. Parylenes; | e.2. Parylenes; | e.2. Parylenes; | e.2. Parylenes; | e.2. Parylenes; | ||
| e.3. Benzocyclobutenes (BCBs); | e.3. Benzocyclobutenes (BCBs); | e.3. Benzocyclobutenes (BCBs); | e.3. Benzocyclobutenes (BCBs); | e.3. Benzocyclobutenes (BCBs); | ||
| e.4. Polybenzoxazoles. | e.4. Polybenzoxazoles. | e.4. Polybenzoxazoles. | e.4. Polybenzoxazoles. | e.4. Polybenzoxazoles. | ||
| 3D991 “Software” specially designed for the “development”, “production”, or “use” of electronic devices, or components controlled by entry 3A991 ..., general purpose electronic equipment controlled by 3A992, or manufacturing and test equipment controlled by 3B991 and 3B992; or “software” specially designed for the “use” of equipment controlled by entry 3B001.g and h of Annex I of the Dual-Use Regulation. | 3D991 “Software” specially designed for the “development”, “production”, or “use” of electronic devices, or components controlled by entry 3A991 ..., general purpose electronic equipment controlled by 3A992, or manufacturing and test equipment controlled by 3B991 and 3B992; or “software” specially designed for the “use” of equipment controlled by entry 3B001.g and h of Annex I of the Dual-Use Regulation. | 3D991 “Software” specially designed for the “development”, “production”, or “use” of electronic devices, or components controlled by entry 3A991 ..., general purpose electronic equipment controlled by 3A992, or manufacturing and test equipment controlled by 3B991 and 3B992; or “software” specially designed for the “use” of equipment controlled by entry 3B001.g and h of Annex I of the Dual-Use Regulation. | 3D991 “Software” specially designed for the “development”, “production”, or “use” of electronic devices, or components controlled by entry 3A991 ..., general purpose electronic equipment controlled by 3A992, or manufacturing and test equipment controlled by 3B991 and 3B992; or “software” specially designed for the “use” of equipment controlled by entry 3B001.g and h of Annex I of the Dual-Use Regulation. | 3D991 “Software” specially designed for the “development”, “production”, or “use” of electronic devices, or components controlled by entry 3A991 ..., general purpose electronic equipment controlled by 3A992, or manufacturing and test equipment controlled by 3B991 and 3B992; or “software” specially designed for the “use” of equipment controlled by entry 3B001.g and h of Annex I of the Dual-Use Regulation. | 3D991 “Software” specially designed for the “development”, “production”, or “use” of electronic devices, or components controlled by entry 3A991 ..., general purpose electronic equipment controlled by 3A992, or manufacturing and test equipment controlled by 3B991 and 3B992; or “software” specially designed for the “use” of equipment controlled by entry 3B001.g and h of Annex I of the Dual-Use Regulation. | 3D991 “Software” specially designed for the “development”, “production”, or “use” of electronic devices, or components controlled by entry 3A991 ..., general purpose electronic equipment controlled by 3A992, or manufacturing and test equipment controlled by 3B991 and 3B992; or “software” specially designed for the “use” of equipment controlled by entry 3B001.g and h of Annex I of the Dual-Use Regulation. |
| 3D992 “Software” specially designed for the test, “development” or “production” of Printed Circuit Boards (PCBs). | 3D992 “Software” specially designed for the test, “development” or “production” of Printed Circuit Boards (PCBs). | 3D992 “Software” specially designed for the test, “development” or “production” of Printed Circuit Boards (PCBs). | 3D992 “Software” specially designed for the test, “development” or “production” of Printed Circuit Boards (PCBs). | 3D992 “Software” specially designed for the test, “development” or “production” of Printed Circuit Boards (PCBs). | 3D992 “Software” specially designed for the test, “development” or “production” of Printed Circuit Boards (PCBs). | 3D992 “Software” specially designed for the test, “development” or “production” of Printed Circuit Boards (PCBs). |
| 3E991 “Technology” for the “development,” “production” or “use” of electronic devices or components controlled by entry 3A991 ..., general purpose electronic equipment controlled by 3A992, or manufacturing and test equipment controlled by 3B991 or 3B992, or materials controlled by 3C992. | 3E991 “Technology” for the “development,” “production” or “use” of electronic devices or components controlled by entry 3A991 ..., general purpose electronic equipment controlled by 3A992, or manufacturing and test equipment controlled by 3B991 or 3B992, or materials controlled by 3C992. | 3E991 “Technology” for the “development,” “production” or “use” of electronic devices or components controlled by entry 3A991 ..., general purpose electronic equipment controlled by 3A992, or manufacturing and test equipment controlled by 3B991 or 3B992, or materials controlled by 3C992. | 3E991 “Technology” for the “development,” “production” or “use” of electronic devices or components controlled by entry 3A991 ..., general purpose electronic equipment controlled by 3A992, or manufacturing and test equipment controlled by 3B991 or 3B992, or materials controlled by 3C992. | 3E991 “Technology” for the “development,” “production” or “use” of electronic devices or components controlled by entry 3A991 ..., general purpose electronic equipment controlled by 3A992, or manufacturing and test equipment controlled by 3B991 or 3B992, or materials controlled by 3C992. | 3E991 “Technology” for the “development,” “production” or “use” of electronic devices or components controlled by entry 3A991 ..., general purpose electronic equipment controlled by 3A992, or manufacturing and test equipment controlled by 3B991 or 3B992, or materials controlled by 3C992. | 3E991 “Technology” for the “development,” “production” or “use” of electronic devices or components controlled by entry 3A991 ..., general purpose electronic equipment controlled by 3A992, or manufacturing and test equipment controlled by 3B991 or 3B992, or materials controlled by 3C992. |
| 3E992 “Technology” for the “development”, “production” or “use” of Printed Circuit Boards (PCBs). | 3E992 “Technology” for the “development”, “production” or “use” of Printed Circuit Boards (PCBs). | 3E992 “Technology” for the “development”, “production” or “use” of Printed Circuit Boards (PCBs). | 3E992 “Technology” for the “development”, “production” or “use” of Printed Circuit Boards (PCBs). | 3E992 “Technology” for the “development”, “production” or “use” of Printed Circuit Boards (PCBs). | 3E992 “Technology” for the “development”, “production” or “use” of Printed Circuit Boards (PCBs). | 3E992 “Technology” for the “development”, “production” or “use” of Printed Circuit Boards (PCBs). |
PART 3 — Computers
| 4A994 Computers, “electronic assemblies” and related equipment, and specially designed components therefor. | 4A994 Computers, “electronic assemblies” and related equipment, and specially designed components therefor. | 4A994 Computers, “electronic assemblies” and related equipment, and specially designed components therefor. |
|---|---|---|
| Note 1: The control status of the “digital computers” and related equipment described in 4A994 is determined by the control status of other equipment or systems provided:a. The “digital computers” or related equipment are essential for the operation of the other equipment or systems;b. The “digital computers” or related equipment are not a “principal element” of the other equipment or systems; andN.b. 1: The control status of “signal processing” or “image enhancement” equipment specially designed for other equipment with functions limited to those required for the other equipment is determined by the control status of the other equipment even if it exceeds the “principal element” criterion.N.b. 2: For the control status of “digital computers” or related equipment for telecommunications equipment, see Category 5, Part 1 (Telecommunications) of Annex I of the Dual-Use Regulation.c. The “technology” for the “digital computers” and related equipment is determined by Category 4E of Annex I of the Dual-Use Regulation. | Note 1: The control status of the “digital computers” and related equipment described in 4A994 is determined by the control status of other equipment or systems provided:a. The “digital computers” or related equipment are essential for the operation of the other equipment or systems;b. The “digital computers” or related equipment are not a “principal element” of the other equipment or systems; andN.b. 1: The control status of “signal processing” or “image enhancement” equipment specially designed for other equipment with functions limited to those required for the other equipment is determined by the control status of the other equipment even if it exceeds the “principal element” criterion.N.b. 2: For the control status of “digital computers” or related equipment for telecommunications equipment, see Category 5, Part 1 (Telecommunications) of Annex I of the Dual-Use Regulation.c. The “technology” for the “digital computers” and related equipment is determined by Category 4E of Annex I of the Dual-Use Regulation. | Note 1: The control status of the “digital computers” and related equipment described in 4A994 is determined by the control status of other equipment or systems provided:a. The “digital computers” or related equipment are essential for the operation of the other equipment or systems;b. The “digital computers” or related equipment are not a “principal element” of the other equipment or systems; andN.b. 1: The control status of “signal processing” or “image enhancement” equipment specially designed for other equipment with functions limited to those required for the other equipment is determined by the control status of the other equipment even if it exceeds the “principal element” criterion.N.b. 2: For the control status of “digital computers” or related equipment for telecommunications equipment, see Category 5, Part 1 (Telecommunications) of Annex I of the Dual-Use Regulation.c. The “technology” for the “digital computers” and related equipment is determined by Category 4E of Annex I of the Dual-Use Regulation. |
| a. Electronic computers and related equipment, and “electronic assemblies” and specially designed components therefor, rated for operation at an ambient temperature above 343 K (70°C); | a. Electronic computers and related equipment, and “electronic assemblies” and specially designed components therefor, rated for operation at an ambient temperature above 343 K (70°C); | |
| b. “Digital computers”, including “signal processing” or ”image enhancement” equipment, having an “Adjusted Peak Performance” (“APP”) equal to or greater than 0.0128 Weighted TeraFLOPS (WT); | b. “Digital computers”, including “signal processing” or ”image enhancement” equipment, having an “Adjusted Peak Performance” (“APP”) equal to or greater than 0.0128 Weighted TeraFLOPS (WT); | |
| c. “Electronic assemblies” that are specially designed or modified to enhance performance by aggregation of processors, as follows: | c. “Electronic assemblies” that are specially designed or modified to enhance performance by aggregation of processors, as follows: | |
| c.1. Designed to be capable of aggregation in configurations of 16 or more processors; | ||
| c.2. Not used. | ||
| Note 1: 4A994.c applies only to “electronic assemblies” and programmable interconnections with a “APP” not exceeding the limits in 4A994.b, when shipped as unintegrated “electronic assemblies”. It does not apply to “electronic assemblies” inherently limited by nature of their design for use as related equipment controlled by 4A994.k.Note 2: 4A994.c does not control any “electronic assembly” specially designed for a product or family of products whose maximum configuration does not exceed the limits of 4A994.b. | Note 1: 4A994.c applies only to “electronic assemblies” and programmable interconnections with a “APP” not exceeding the limits in 4A994.b, when shipped as unintegrated “electronic assemblies”. It does not apply to “electronic assemblies” inherently limited by nature of their design for use as related equipment controlled by 4A994.k.Note 2: 4A994.c does not control any “electronic assembly” specially designed for a product or family of products whose maximum configuration does not exceed the limits of 4A994.b. | |
| d. Not used; | d. Not used; | |
| e. Not used; | e. Not used; | |
| f. Equipment for “signal processing” or “image enhancement” having an “Adjusted Peak Performance” (“APP”) equal to or greater than 0.0128 Weighted TeraFLOPS WT; | f. Equipment for “signal processing” or “image enhancement” having an “Adjusted Peak Performance” (“APP”) equal to or greater than 0.0128 Weighted TeraFLOPS WT; | |
| g. Not used; | g. Not used; | |
| h. Not used; | h. Not used; | |
| i. Equipment containing “terminal interface equipment” exceeding the limits in 5A991; | i. Equipment containing “terminal interface equipment” exceeding the limits in 5A991; | |
| j. Equipment specially designed to provide external interconnection of “digital computers” or associated equipment that allows communications at data rates exceeding 80 Mbyte/s; | j. Equipment specially designed to provide external interconnection of “digital computers” or associated equipment that allows communications at data rates exceeding 80 Mbyte/s; | |
| Note:4A994.j does not control internal interconnection equipment (e.g., backplanes, buses) passive interconnection equipment, “network access controllers” or “communication channel controllers”. | Note:4A994.j does not control internal interconnection equipment (e.g., backplanes, buses) passive interconnection equipment, “network access controllers” or “communication channel controllers”. | |
| k. “Hybrid computers” and “electronic assemblies” and specially designed components therefor containing analogue-to-digital converters having all of the following: | k. “Hybrid computers” and “electronic assemblies” and specially designed components therefor containing analogue-to-digital converters having all of the following: | |
| k.1. 32 channels or more; and | ||
| k.2. A resolution of 14 bit (plus sign bit) or more with a conversion rate of 200,000 Hz or more. | ||
| 4D993 “Program” proof and validation “software,” “software” allowing the automatic generation of “source codes,” and operating system “software” that are specially designed for “real-time processing” equipment. | 4D993 “Program” proof and validation “software,” “software” allowing the automatic generation of “source codes,” and operating system “software” that are specially designed for “real-time processing” equipment. | 4D993 “Program” proof and validation “software,” “software” allowing the automatic generation of “source codes,” and operating system “software” that are specially designed for “real-time processing” equipment. |
| a. “Program” proof and validation “software” using mathematical and analytical techniques and designed or modified for “programs” having more than 500,000 “source code” instructions; | a. “Program” proof and validation “software” using mathematical and analytical techniques and designed or modified for “programs” having more than 500,000 “source code” instructions; | |
| b. “Software” allowing the automatic generation of “source codes” from data acquired on line from external sensors described in Annex I of the Dual-Use Regulation; | b. “Software” allowing the automatic generation of “source codes” from data acquired on line from external sensors described in Annex I of the Dual-Use Regulation; | |
| c. Operating system “software” specially designed for “real-time processing” equipment that guarantees a “global interrupt latency time” of less than 20 µs. | c. Operating system “software” specially designed for “real-time processing” equipment that guarantees a “global interrupt latency time” of less than 20 µs. | |
| Note: “Global interrupt latency time” is the time taken by the computer system to recognise an interrupt due to the event, service the interrupt and perform a context switch to an alternate memory-resident task waiting on the interrupt. | Note: “Global interrupt latency time” is the time taken by the computer system to recognise an interrupt due to the event, service the interrupt and perform a context switch to an alternate memory-resident task waiting on the interrupt. | Note: “Global interrupt latency time” is the time taken by the computer system to recognise an interrupt due to the event, service the interrupt and perform a context switch to an alternate memory-resident task waiting on the interrupt. |
| 4D994 Software” other than that controlled in entry 4D001 of Annex I of the Dual-Use Regulation specially designed or modified for the “development”, “production”, or “use” of equipment controlled by entry 4A101 of Annex I of the Dual-Use Regulation, or 4A994. | 4D994 Software” other than that controlled in entry 4D001 of Annex I of the Dual-Use Regulation specially designed or modified for the “development”, “production”, or “use” of equipment controlled by entry 4A101 of Annex I of the Dual-Use Regulation, or 4A994. | 4D994 Software” other than that controlled in entry 4D001 of Annex I of the Dual-Use Regulation specially designed or modified for the “development”, “production”, or “use” of equipment controlled by entry 4A101 of Annex I of the Dual-Use Regulation, or 4A994. |
| 4E992 “Technology” for the “development,” “production,” or “use” of equipment controlled by 4A994, or “software” controlled by 4D993 or 4D994. | 4E992 “Technology” for the “development,” “production,” or “use” of equipment controlled by 4A994, or “software” controlled by 4D993 or 4D994. | 4E992 “Technology” for the “development,” “production,” or “use” of equipment controlled by 4A994, or “software” controlled by 4D993 or 4D994. |
| 4E993 “Technology” for the “development” or “production” of equipment designed for “multi-data-stream processing.” | 4E993 “Technology” for the “development” or “production” of equipment designed for “multi-data-stream processing.” | 4E993 “Technology” for the “development” or “production” of equipment designed for “multi-data-stream processing.” |
PART 4 — Telecommunications and information security
CHAPTER 1 — Telecommunication equipment
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